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PSoCTM Mixed Signal Array
CY8C27143, CY8C27243, CY8C27443, CY8C27543, and CY8C27643
Final Data Sheet
Features
Powerful Harvard Architecture Processor M8C Processor Speeds to 24 MHz 8x8 Multiply, 32-Bit Accumulate Low Power at High Speed 3.0 to 5.25 V Operating Voltage Operating Voltages Down to 1.0V Using OnChip Switch Mode Pump (SMP) Industrial Temperature Range: -40C to +85C Advanced Peripherals (PSoC Blocks) 12 Rail-to-Rail Analog PSoC Blocks Provide: - Up to 14-Bit ADCs - Up to 9-Bit DACs - Programmable Gain Amplifiers - Programmable Filters and Comparators 8 Digital PSoC Blocks Provide: - 8- to 32-Bit Timers, Counters, and PWMs - CRC and PRS Modules - Up to 2 Full-Duplex UARTs - Multiple SPITM Masters or Slaves - Connectable to all GPIO Pins Complex Peripherals by Combining Blocks Precision, Programmable Clocking Internal 2.5% 24/48 MHz Oscillator 24/48 MHz with Optional 32 kHz Crystal Optional External Oscillator, up to 24 MHz Internal Oscillator for Watchdog and Sleep Flexible On-Chip Memory 16K Bytes Flash Program Storage 50,000 Erase/Write Cycles 256 Bytes SRAM Data Storage In-System Serial Programming (ISSPTM) Partial Flash Updates Flexible Protection Modes EEPROM Emulation in Flash Programmable Pin Configurations 25 mA Sink on all GPIO Pull up, Pull down, High Z, Strong, or Open Drain Drive Modes on all GPIO Up to 12 Analog Inputs on GPIO Four 30 mA Analog Outputs on GPIO Configurable Interrupt on all GPIO Additional System Resources I2CTM Slave, Master, and Multi-Master to 400 kHz Watchdog and Sleep Timers User-Configurable Low Voltage Detection Integrated Supervisory Circuit On-Chip Precision Voltage Reference Complete Development Tools Free Development Software (PSoCTM Designer) Full-Featured, In-Circuit Emulator and Programmer Full Speed Emulation Complex Breakpoint Structure 128K Bytes Trace Memory
Port 5 Port 4 Port 3 Port 2 Port 1 Port 0
Analog Drivers
PSoCTM Functional Overview
The PSoCTM family consists of many Mixed Signal Array with On-Chip Controller devices. These devices are designed to replace multiple traditional MCU-based system components with one, low cost single-chip programmable device. PSoC devices include configurable blocks of analog and digital logic, as well as programmable interconnects. This architecture allows the user to create customized peripheral configurations that match the requirements of each individual application. Additionally, a fast CPU, Flash program memory, SRAM data memory, and configurable IO are included in a range of convenient pinouts and packages. The PSoC architecture, as illustrated on the left, is comprised of four main areas: PSoC Core, Digital System, Analog System, and System Resources. Configurable global busing allows all the device resources to be combined into a complete custom system. The PSoC CY8C27x43 family can have up to five IO ports that connect to the global digital and analog interconnects, providing access to 8 digital blocks and 12 analog blocks.
PSoC CORE
System Bus
Global Digital Interconnect SRAM 256 Bytes Interrupt Controller
Global Analog Interconnect Flash 16K Sleep and Watchdog
SROM
CPU Core (M8C)
Multiple Clock Sources (Includes IMO, ILO, PLL, and ECO)
DIGITAL SYSTEM
Digital Block Array
(2 Rows, 8 Blocks)
ANALOG SYSTEM
Analog Block Array
(4 Columns, 12 Blocks) Analog Ref
Analog Input Muxing
The PSoC Core
The PSoC Core is a powerful engine that supports a rich feature set. The core includes a CPU, memory, clocks, and configurable GPIO (General Purpose IO). The M8C CPU core is a powerful processor with speeds up to 24 MHz, providing a four MIPS 8-bit Harvard architecture micro-
Digital Clocks
Multiply Accum.
POR and LVD Decimator I 2C System Resets
Internal Voltage Ref.
Switch Mode Pump
SYSTEM RESOURCES
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PSoCTM Overview
processor. The CPU utilizes an interrupt controller with 17 vectors, to simplify programming of real time embedded events. Program execution is timed and protected using the included Sleep and Watch Dog Timers (WDT). Memory encompasses 16 KB of Flash for program storage, 256 bytes of SRAM for data storage, and up to 2 KB of EEPROM emulated using the Flash. Program Flash utilizes four protection levels on blocks of 64 bytes, allowing customized software IP protection. The PSoC device incorporates flexible internal clock generators, including a 24 MHz IMO (internal main oscillator) accurate to 2.5% over temperature and voltage. The 24 MHz IMO can also be doubled to 48 MHz for use by the digital system. A low power 32 kHz ILO (internal low speed oscillator) is provided for the Sleep timer and WDT. If crystal accuracy is desired, the ECO (32.768 kHz external crystal oscillator) is available for use as a Real Time Clock (RTC) and can optionally generate a crystal-accurate 24 MHz system clock using a PLL. The clocks, together with programmable clock dividers (as a System Resource), provide the flexibility to integrate almost any timing requirement into the PSoC device. PSoC GPIOs provide connection to the CPU, digital and analog resources of the device. Each pin's drive mode may be selected from eight options, allowing great flexibility in external interfacing. Every pin also has the capability to generate a system interrupt on high level, low level, and change from last read.
Digital peripheral configurations include those listed below.

PWMs (8 to 32 bit) PWMs with Dead band (8 to 32 bit) Counters (8 to 32 bit) Timers (8 to 32 bit) UART 8 bit with selectable parity (up to 2) SPI master and slave (up to 2) I2C slave and master (1 available as a System Resource) Cyclical Redundancy Checker/Generator (8 to 32 bit) IrDA (up to 2) Pseudo Random Sequence Generators (8 to 32 bit)
The digital blocks can be connected to any GPIO through a series of global buses that can route any signal to any pin. The buses also allow for signal multiplexing and for performing logic operations. This configurability frees your designs from the constraints of a fixed peripheral controller. Digital blocks are provided in rows of four, where the number of blocks varies by PSoC device family. This allows you the optimum choice of system resources for your application. Family resources are shown in the table titled "PSoC Device Characteristics" on page 3.
The Analog System
The Analog System is composed of 12 configurable blocks, each comprised of an opamp circuit allowing the creation of complex analog signal flows. Analog peripherals are very flexible and can be customized to support specific application requirements. Some of the more common PSoC analog functions (most available as user modules) are listed below.
The Digital System
The Digital System is composed of 8 digital PSoC blocks. Each block is an 8-bit resource that can be used alone or combined with other blocks to form 8, 16, 24, and 32-bit peripherals, which are called user module references.
Port 5 Port 4 Port 3 Port 2 Port 1 Port 0
Analog-to-digital converters (up to 4, with 6- to 14-bit resolution, selectable as Incremental, Delta Sigma, and SAR) Filters (2, 4, 6, and 8 pole band-pass, low-pass, and notch) Amplifiers (up to 4, with selectable gain to 48x) Instrumentation amplifiers (up to 2, with selectable gain to 93x) Comparators (up to 4, with 16 selectable thresholds) DACs (up to 4, with 6- to 9-bit resolution) Multiplying DACs (up to 4, with 6- to 9-bit resolution) High current output drivers (four with 30 mA drive as a Core Resource) 1.3V reference (as a System Resource) DTMF dialer Modulators Correlators Peak detectors Many other topologies possible

Digital Clocks From Core
To System Bus
To Analog System
DIGITAL SYSTEM
Digital PSoC Block Array

Row Input Configuration
Row 0
DBB00 DBB01 DCB02
4 DCB03 4
Row Output Configuration
8
8 8
Row Input Configuration
8
Row 1
DBB10 DBB11 DCB12
4 DCB13 4

Row Output Configuration
GIE[7:0] GIO[7:0]
Global Digital Interconnect
GOE[7:0] GOO[7:0]
Digital System Block Diagram
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PSoCTM Overview
Analog blocks are provided in columns of three, which includes one CT (Continuous Time) and two SC (Switched Capacitor) blocks, as shown in the figure below.
P0[7] P0[5] P0[3] P0[1]
AGNDIn RefIn
Additional System Resources
System Resources, some of which have been previously listed, provide additional capability useful to complete systems. Additional resources include a multiplier, decimator, switch mode pump, low voltage detection, and power on reset. Brief statements describing the merits of each system resource are presented below.
P0[6] P0[4] P0[2] P0[0] P2[6]
Digital clock dividers provide three customizable clock frequencies for use in applications. The clocks can be routed to both the digital and analog systems. Additional clocks can be generated using digital PSoC blocks as clock dividers. A multiply accumulate (MAC) provides a fast 8-bit multiplier with 32-bit accumulate, to assist in both general math as well as digital filters. The decimator provides a custom hardware filter for digital signal processing applications including the creation of Delta Sigma ADCs. The I2C module provides 100 and 400 kHz communication over two wires. Slave, master, and multi-master modes are all supported. Low Voltage Detection (LVD) interrupts can signal the application of falling voltage levels, while the advanced POR (Power On Reset) circuit eliminates the need for a system supervisor. An internal 1.3V reference provides an absolute reference for the analog system, including ADCs and DACs. An integrated switch mode pump (SMP) generates normal operating voltages from a single 1.2V battery cell, providing a low cost boost converter.
P2[3]
P2[4] P2[2] P2[0]
P2[1]
Array Input Configuration
ACI0[1:0]
ACI1[1:0]
ACI2[1:0]
ACI3[1:0]
Block Array
ACB00 ASC10 ASD20 ACB01 ASD11 ASC21 ACB02 ASC12 ASD22 ACB03 ASD13 ASC23
PSoC Device Characteristics
Depending on your PSoC device characteristics, the digital and analog systems can have 16, 8, or 4 digital blocks and 12, 6, or 3 analog blocks. The following table lists the resources available for specific PSoC device groups. The PSoC device covered by this data sheet is shown in the second row of the table. PSoC Device Characteristics
Analog Columns Analog Outputs Analog Inputs
Analog Reference
Interface to Digital System RefHi RefLo AGND Reference Generators AGNDIn RefIn Bandgap
M8C Interface (Address Bus, Data Bus, Etc.)
PSoC Part Number
Analog System Block Diagram
CY8C29x66 CY8C27x43 CY8C24x23 CY8C24x23A CY8C22x13
up to 64 up to 44 up to 24 up to 24 up to 16
4 2 1 1 1
16 8 4 4 4
12 12 12 12 8
4 4 2 2 1
4 4 2 2 1
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Analog Blocks
Digital Blocks
Digital IO
Digital Rows
12 12 6 6 3
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CY8C27x43 Final Data Sheet
PSoCTM Overview
Getting Started
The quickest path to understanding the PSoC silicon is by reading this data sheet and using the PSoC Designer Integrated Development Environment (IDE). This data sheet is an overview of the PSoC integrated circuit and presents specific pin, register, and electrical specifications. For in-depth information, along with detailed programming information, reference the PSoCTM Mixed Signal Array Technical Reference Manual. For up-to-date Ordering, Packaging, and Electrical Specification information, reference the latest PSoC device data sheets on the web at http://www.cypress.com/psoc.
Development Tools
The Cypress MicroSystems PSoC Designer is a Microsoft(R) Windows-based, integrated development environment for the Programmable System-on-Chip (PSoC) devices. The PSoC Designer IDE and application runs on Windows NT 4.0, Windows 2000, Windows Millennium (Me), or Windows XP. (Reference the PSoC Designer Functional Flow diagram below.) PSoC Designer helps the customer to select an operating configuration for the PSoC, write application code that uses the PSoC, and debug the application. This system provides design database management by project, an integrated debugger with In-Circuit Emulator, in-system programming support, and the CYASM macro assembler for the CPUs. PSoC Designer also supports a high-level C language compiler developed specifically for the devices in the family.
Development Kits
Development Kits are available from the following distributors: Digi-Key, Avnet, Arrow, and Future. The Cypress Online Store at http://www.onfulfillment.com/cypressstore/ contains development kits, C compilers, and all accessories for PSoC development. Click on PSoC (Programmable System-on-Chip) to view a current list of available items.
Commands
Tele-Training
Free PSoC "Tele-training" is available for beginners and taught by a live marketing or application engineer over the phone. Five training classes are available to accelerate the learning curve including introduction, designing, debugging, advanced design, advanced analog, as well as application-specific classes covering topics like PSoC and the LIN bus. For days and times of the tele-training, see http://www.cypress.com/support/training.cfm.
PSoCTM Designer
Graphical Designer Interface
Context Sensitive Help
Results
Importable Design Database Device Database Application Database Project Database User Modules Library PSoC Configuration Sheet
Consultants
Certified PSoC Consultants offer everything from technical assistance to completed PSoC designs. To contact or become a PSoC Consultant, go to the following Cypress support web site: http://www.cypress.com/support/cypros.cfm.
PSoC Designer Core Engine
TM
Manufacturing Information File
Technical Support
PSoC application engineers take pride in fast and accurate response. They can be reached with a 4-hour guaranteed response at http://www.cypress.com/support/login.cfm.
Application Notes
A long list of application notes will assist you in every aspect of your design effort. To locate the PSoC application notes, go to http://www.cypress.com/design/results.cfm.
Emulation Pod In-Circuit Emulator Device Programmer
PSoC Designer Subsystems
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PSoCTM Overview
PSoC Designer Software Subsystems
Device Editor
The Device Editor subsystem allows the user to select different onboard analog and digital components called user modules using the PSoC blocks. Examples of user modules are ADCs, DACs, Amplifiers, and Filters. The device editor also supports easy development of multiple configurations and dynamic reconfiguration. Dynamic configuration allows for changing configurations at run time. PSoC Designer sets up power-on initialization tables for selected PSoC block configurations and creates source code for an application framework. The framework contains software to operate the selected components and, if the project uses more than one operating configuration, contains routines to switch between different sets of PSoC block configurations at run time. PSoC Designer can print out a configuration sheet for a given project configuration for use during application programming in conjunction with the Device Data Sheet. Once the framework is generated, the user can add application-specific code to flesh out the framework. It's also possible to change the selected components and regenerate the framework.
Debugger
The PSoC Designer Debugger subsystem provides hardware in-circuit emulation, allowing the designer to test the program in a physical system while providing an internal view of the PSoC device. Debugger commands allow the designer to read and program and read and write data memory, read and write IO registers, read and write CPU registers, set and clear breakpoints, and provide program run, halt, and step control. The debugger also allows the designer to create a trace buffer of registers and memory locations of interest.
Online Help System
The online help system displays online, context-sensitive help for the user. Designed for procedural and quick reference, each functional subsystem has its own context-sensitive help. This system also provides tutorials and links to FAQs and an Online Support Forum to aid the designer in getting started.
Hardware Tools
In-Circuit Emulator
Design Browser
The Design Browser allows users to select and import preconfigured designs into the user's project. Users can easily browse a catalog of preconfigured designs to facilitate time-to-design. Examples provided in the tools include a 300-baud modem, LIN Bus master and slave, fan controller, and magnetic card reader.
A low cost, high functionality ICE (In-Circuit Emulator) is available for development support. This hardware has the capability to program single devices. The emulator consists of a base unit that connects to the PC by way of the parallel or USB port. The base unit is universal and will operate with all PSoC devices. Emulation pods for each device family are available separately. The emulation pod takes the place of the PSoC device in the target board and performs full speed (24 MHz) operation.
Application Editor
In the Application Editor you can edit your C language and Assembly language source code. You can also assemble, compile, link, and build.
Assembler. The macro assembler allows the assembly code to be merged seamlessly with C code. The link libraries automatically use absolute addressing or can be compiled in relative mode, and linked with other software modules to get absolute addressing. C Language Compiler. A C language compiler is available that supports Cypress MicroSystems' PSoC family devices. Even if you have never worked in the C language before, the product quickly allows you to create complete C programs for the PSoC family devices.
The embedded, optimizing C compiler provides all the features of C tailored to the PSoC architecture. It comes complete with embedded libraries providing port and bus operations, standard keypad and display support, and extended math functionality.
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Designing with User Modules
The development process for the PSoC device differs from that of a traditional fixed function microprocessor. The configurable analog and digital hardware blocks give the PSoC architecture a unique flexibility that pays dividends in managing specification change during development and by lowering inventory costs. These configurable resources, called PSoC Blocks, have the ability to implement a wide variety of user-selectable functions. Each block has several registers that determine its function and connectivity to other blocks, multiplexers, buses, and to the IO pins. Iterative development cycles permit you to adapt the hardware as well as the software. This substantially lowers the risk that you will have to select a different part to meet the final design requirements. To speed the development process, the PSoC Designer Integrated Development Environment (IDE) provides a library of pre-built, pre-tested hardware peripheral functions, called "User Modules." User modules make selecting and implementing peripheral devices simple, and come in analog, digital, and mixed signal varieties. The standard User Module library contains over 50 common peripherals such as ADCs, DACs Timers, Counters, UARTs, and other not-so common peripherals such as DTMF Generators and Bi-Quad analog filter sections. Each user module establishes the basic register settings that implement the selected function. It also provides parameters that allow you to tailor its precise configuration to your particular application. For example, a Pulse Width Modulator User Module configures one or more digital PSoC blocks, one for each 8 bits of resolution. The user module parameters permit you to establish the pulse width and duty cycle. User modules also provide tested software to cut your development time. The user module application programming interface (API) provides highlevel functions to control and respond to hardware events at run-time. The API also provides optional interrupt service routines that you can adapt as needed. The API functions are documented in user module data sheets that are viewed directly in the PSoC Designer IDE. These data sheets explain the internal operation of the user module and provide performance specifications. Each data sheet describes the use of each user module parameter and documents the setting of each register controlled by the user module. The development process starts when you open a new project and bring up the Device Editor, a graphical user interface (GUI) for configuring the hardware. You pick the user modules you need for your project and map them onto the PSoC blocks with point-and-click simplicity. Next, you build signal chains by interconnecting user modules to each other and the IO pins. At this stage, you also configure the clock source connections and enter parameter values directly or by selecting values from drop-down menus. When you are ready to test the hardware configuration or move on to developing code for the project, you perform the "Generate Application" step. This causes PSoC Designer to generate source code that automatically configures the device to your specification and provides the high-level user module API functions.
Device Editor
User Module Selection Placement and Parameter -ization Source Code Generator
Generate Application
Application Editor
Project Manager Source Code Editor Build Manager
Build All
Debugger
Interface to ICE Storage Inspector Event & Breakpoint Manager
User Module and Source Code Development Flows
The next step is to write your main program, and any sub-routines using PSoC Designer's Application Editor subsystem. The Application Editor includes a Project Manager that allows you to open the project source code files (including all generated code files) from a hierarchal view. The source code editor provides syntax coloring and advanced edit features for both C and assembly language. File search capabilities include simple string searches and recursive "grep-style" patterns. A single mouse click invokes the Build Manager. It employs a professional-strength "makefile" system to automatically analyze all file dependencies and run the compiler and assembler as necessary. Project-level options control optimization strategies used by the compiler and linker. Syntax errors are displayed in a console window. Double clicking the error message takes you directly to the offending line of source code. When all is correct, the linker builds a HEX file image suitable for programming. The last step in the development process takes place inside the PSoC Designer's Debugger subsystem. The Debugger downloads the HEX image to the In-Circuit Emulator (ICE) where it runs at full speed. Debugger capabilities rival those of systems costing many times more. In addition to traditional single-step, run-to-breakpoint and watch-variable features, the Debugger provides a large trace buffer and allows you define complex breakpoint events that include monitoring address and data bus values, memory locations and external signals.
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Document Conventions
Acronyms Used
The following table lists the acronyms that are used in this document.
Acronym Description
Table of Contents
For an in depth discussion and more information on your PSoC device, obtain the PSoC Mixed Signal Array Technical Reference Manual. This document encompasses and is organized into the following chapters and sections.
1. Pin Information ............................................................. 8 1.1 Pinouts ................................................................... 8
1.1.1 1.1.2 1.1.3 1.1.4 1.1.5 8-Pin Part Pinout .................................................8 20-Pin Part Pinout ...............................................9 28-Pin Part Pinout .............................................10 44-Pin Part Pinout .............................................11 48-Pin Part Pinouts ...........................................12
AC ADC API CPU CT DAC DC ECO EEPROM FSR GPIO GUI HBM ICE ILO IMO IO IPOR LSb LVD MSb PC PLL POR PPOR PSoCTM PWM RAM SC SLIMO SMP
alternating current analog-to-digital converter application programming interface central processing unit continuous time digital-to-analog converter direct current external crystal oscillator electrically erasable programmable read-only memory full scale range general purpose IO graphical user interface human body model in-circuit emulator internal low speed oscillator internal main oscillator input/output imprecise power on reset least-significant bit low voltage detect most-significant bit program counter phase-locked loop power on reset precision power on reset Programmable System-on-ChipTM pulse width modulator random access memory switched capacitor slow IMO switch mode pump
2.
Register Reference ..................................................... 14 2.1 Register Conventions ........................................... 14 2.2 Register Mapping Tables ..................................... 14 Electrical Specifications ............................................ 17 3.1 Absolute Maximum Ratings ................................ 18 3.2 Operating Temperature ....................................... 18 3.3 DC Electrical Characteristics ................................ 19
3.3.1 3.3.2 3.3.3 3.3.4 3.3.5 3.3.6 3.3.7 3.3.8 3.3.9 DC Chip-Level Specifications .............................19 DC General Purpose IO Specifications ..............19 DC Operational Amplifier Specifications ............20 DC Analog Output Buffer Specifications ............22 DC Switch Mode Pump Specifications ...............23 DC Analog Reference Specifications .................24 DC Analog PSoC Block Specifications ...............26 DC POR and LVD Specifications .......................26 DC Programming Specifications ........................27 AC Chip-Level Specifications .............................28 AC General Purpose IO Specifications ..............30 AC Operational Amplifier Specifications .............31 AC Digital Block Specifications ..........................32 AC Analog Output Buffer Specifications .............33 AC External Clock Specifications .......................34 AC Programming Specifications .........................34 AC I2C Specifications .........................................35
3.
3.4
AC Electrical Characteristics ................................ 28
3.4.1 3.4.2 3.4.3 3.4.4 3.4.5 3.4.6 3.4.7 3.4.8
4.
Packaging Information ............................................... 36 4.1 Packaging Dimensions ......................................... 36 4.2 Thermal Impedances .......................................... 41 4.3 Capacitance on Crystal Pins ............................... 41 Ordering Information .................................................. 42 5.1 Ordering Code Definitions ................................... 43 Sales and Service Information .................................. 44 6.1 Revision History ................................................... 44 6.2 Copyrights and Code Protection .......................... 44
Units of Measure
A units of measure table is located in the Electrical Specifications section. Table 3-1 on page 17 lists all the abbreviations used to measure the PSoC devices.
5. 6.
Numeric Naming
Hexidecimal numbers are represented with all letters in uppercase with an appended lowercase `h' (for example, `14h' or `3Ah'). Hexidecimal numbers may also be represented by a `0x' prefix, the C coding convention. Binary numbers have an appended lowercase `b' (e.g., 01010100b' or `01000011b'). Numbers not indicated by an `h' or `b' are decimal.
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1. Pin Information
This chapter describes, lists, and illustrates the CY8C27x43 PSoC device pins and pinout configurations.
1.1
Pinouts
The CY8C27x43 PSoC device is available in a variety of packages which are listed and illustrated in the following tables. Every port pin (labeled with a "P") is capable of Digital IO. However, Vss, Vdd, SMP, and XRES are not capable of Digital IO.
1.1.1
8-Pin Part Pinout
Type
Table 1-1. 8-Pin Part Pinout (PDIP)
Pin No.
1 2 3 4 5 6 7 8 IO IO IO Power IO IO
Digital Analog
Pin Name
P0[5] P0[3] P1[1] Vss P1[0] P0[2] P0[4] Vdd
Description
Analog column mux input and column output. Analog column mux input and column output. Crystal Input (XTALin), I2C Serial Clock (SCL) Ground connection. Crystal Output (XTALout), I2C Serial Data (SDA) Analog column mux input and column output. Analog column mux input and column output. Supply voltage.
CY8C27143 8-Pin PSoC Device
AIO, P0[5] AIO, P0[3] I2C SCL, XTALin, P1[1] Vss
IO IO IO Power
IO IO
8 1 2 PDIP 7 6 3 5 4
Vdd P0[4], AIO P0[2], AIO P1[0], XTALout, I2C SDA
LEGEND: A = Analog, I = Input, and O = Output.
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1. Pin Information
1.1.2
20-Pin Part Pinout
Type
Table 1-2. 20-Pin Part Pinout (SSOP, SOIC)
Pin No.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 IO IO IO IO Power IO IO IO IO Input I IO IO I IO IO IO IO Power
Digital Analog
Pin Name
P0[7] P0[5] P0[3] P0[1] SMP P1[7] P1[5] P1[3] P1[1] Vss P1[0] P1[2] P1[4] P1[6] XRES P0[0] P0[2] P0[4] P0[6] Vdd
Description
Analog column mux input. Analog column mux input and column output. Analog column mux input and column output. Analog column mux input. Switch Mode Pump (SMP) connection to external components required. I2C Serial Clock (SCL) I2C Serial Data (SDA) Crystal Input (XTALin), I2C Serial Clock (SCL) Ground connection. Crystal Output (XTALout), I2C Serial Data (SDA) Optional External Clock Input (EXTCLK) Active high external reset with internal pull down. Analog column mux input. Analog column mux input and column output. Analog column mux input and column output. Analog column mux input. Supply voltage.
CY8C27243 20-Pin PSoC Device
AI, P0[7] AIO, P0[5] AIO, P0[3] AI, P0[1] SMP I2C SCL, P1[7] I2C SDA, P1[5] P1[3] I2C SCL, XTALin, P1[1] Vss
IO IO IO IO Power
I IO IO I
1 2 3 4 5 6 7 8 9 10
SSOP SOIC
20 19 18 17 16 15 14 13 12 11
Vdd P0[6], AI P0[4], AIO P0[2], AIO P0[0], AI XRES P1[6] P1[4], EXTCLK P1[2] P1[0], XTALout, I2C SDA
LEGEND: A = Analog, I = Input, and O = Output.
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1. Pin Information
1.1.3
28-Pin Part Pinout
Type
Table 1-3. 28-Pin Part Pinout (PDIP, SSOP, SOIC)
Pin No.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 IO IO IO IO IO IO IO IO Power I IO IO I IO IO IO IO Input I I IO IO IO IO Power
Digital Analog
Pin Name
P0[7] P0[5] P0[3] P0[1] P2[7] P2[5]
Description
Analog column mux input. Analog column mux input and column output. Analog column mux input and column output. Analog column mux input.
CY8C27443 28-Pin PSoC Device
AI, P0[7] AIO, P0[5] AIO, P0[3] AI, P0[1] P2[7] P2[5] AI, P2[3] AI, P2[1] SMP I2C SCL, P1[7] I2C SDA, P1[5] P1[3] I2C SCL, XTALin, P1[1] Vss
IO IO IO IO IO IO IO IO Power
I IO IO I
I I
P2[3] P2[1] SMP P1[7] P1[5] P1[3] P1[1] Vss P1[0] P1[2] P1[4] P1[6] XRES P2[0] P2[2] P2[4] P2[6] P0[0] P0[2] P0[4] P0[6] Vdd
Direct switched capacitor block input. Direct switched capacitor block input. Switch Mode Pump (SMP) connection to external components required. I2C Serial Clock (SCL) I2C Serial Data (SDA) Crystal Input (XTALin), I2C Serial Clock (SCL) Ground connection. Crystal Output (XTALout), I2C Serial Data (SDA) Optional External Clock Input (EXTCLK) Active high external reset with internal pull down. Direct switched capacitor block input. Direct switched capacitor block input. External Analog Ground (AGND) External Voltage Reference (VRef) Analog column mux input. Analog column mux input and column output. Analog column mux input and column output. Analog column mux input. Supply voltage.
1 2 3 4 5 6 7 8 9 10 11 12 13 14
PDIP SSOP SOIC
28 27 26 25 24 23 22 21 20 19 18 17 16 15
Vdd P0[6], AI P0[4], AIO P0[2], AIO P0[0], AI P2[6], External VRef P2[4], External AGND P2[2], AI P2[0], AI XRES P1[6] P1[4], EXTCLK P1[2] P1[0], XTALout, I2C SDA
LEGEND: A = Analog, I = Input, and O = Output.
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10
CY8C27x43 Final Data Sheet
1. Pin Information
1.1.4
44-Pin Part Pinout
Type
Table 1-4. 44-Pin Part Pinout (TQFP)
Pin No.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO Power I IO IO I I IO IO I I I IO IO IO IO IO IO IO IO Input IO IO IO IO IO IO IO IO Power
Digital Analog
Pin Name
P2[5] P2[3] P2[1] P4[7] P4[5] P4[3] P4[1]
Description
CY8C27543 44-Pin PSoC Device
P2[6], External VRef 34
IO IO IO IO IO IO IO Power I I
Direct switched capacitor block input. Direct switched capacitor block input.
P0[3], AIO P0[5], AIO P2[7] P0[1], AI P0[7], AI Vdd P0[6], P0[4], P0[2], P0[0], 38 37 36 35 AI AIO AIO AI
SMP P3[7] P3[5] P3[3] P3[1] P1[7] P1[5] P1[3] P1[1] Vss P1[0] P1[2] P1[4] P1[6] P3[0] P3[2] P3[4] P3[6] XRES P4[0] P4[2] P4[4] P4[6] P2[0] P2[2] P2[4] P2[6] P0[0] P0[2] P0[4] P0[6] Vdd P0[7] P0[5] P0[3] P0[1] P2[7]
Switch Mode Pump (SMP) connection to external components required.
I2C Serial Clock (SCL) I2C Serial Data (SDA) Crystal Input (XTALin), I2C Serial Clock (SCL) Ground connection. Crystal Output (XTALout), I2C Serial Data (SDA) Optional External Clock Input (EXTCLK)
12 13 14 15
16 17 18 19 20 21
Active high external reset with internal pull down.
Direct switched capacitor block input. Direct switched capacitor block input. External Analog Ground (AGND) External Voltage Reference (VRef) Analog column mux input. Analog column mux input and column output. Analog column mux input and column output. Analog column mux input. Supply voltage. Analog column mux input. Analog column mux input and column output. Analog column mux input and column output. Analog column mux input.
LEGEND: A = Analog, I = Input, and O = Output.
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I2C SDA, XTALout, P1[0] P1[2] EXTCLK, P1[4] P1[6] P3[0]
I2C SDA, P1[5] P1[3]
P3[1] I2C SCL, P1[7]
I2C SCL, XTALin, P1[1] Vss
22
P2[5] AI, P2[3] AI, P2[1] P4[7] P4[5] P4[3] P4[1] SMP P3[7] P3[5] P3[3]
43 42 41 40 39
44
1 2 3 4 5 6 7 8 9 10 11
TQFP
33 32 31 30 29 28 27 26 25 24 23
P2[4], External AGND P2[2], AI P2[0], AI P4[6] P4[4] P4[2] P4[0] XRES P3[6] P3[4] P3[2]
11
CY8C27x43 Final Data Sheet
1. Pin Information
1.1.5
48-Pin Part Pinouts
Type
Table 1-5. 48-Pin Part Pinout (SSOP)
Pin No.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 IO IO IO IO IO IO IO IO IO IO IO IO Power I IO IO I I I IO IO IO IO IO IO IO IO IO IO Input IO IO IO IO IO IO IO IO IO IO Power
Digital Analog
Pin Name
P0[7] P0[5] P0[3] P0[1] P2[7] P2[5]
Description
Analog column mux input. Analog column mux input and column output. Analog column mux input and column output. Analog column mux input.
CY8C27643 48-Pin PSoC Device
AI, P0[7] AIO, P0[5] AIO, P0[3] AI, P0[1] P2[7] P2[5] AI, P2[3] AI, P2[1] P4[7] P4[5] P4[3] P4[1] SMP P3[7] P3[5] P3[3] P3[1] P5[3] P5[1] I2C SCL, P1[7] I2C SDA, P1[5] P1[3] I2C SCL, XTALin, P1[1] Vss 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
IO IO IO IO IO IO IO IO IO IO IO IO Power
I IO IO I
I I
P2[3] P2[1] P4[7] P4[5] P4[3] P4[1] SMP P3[7] P3[5] P3[3] P3[1] P5[3] P5[1] P1[7] P1[5] P1[3] P1[1] Vss P1[0] P1[2] P1[4] P1[6] P5[0] P5[2] P3[0] P3[2] P3[4] P3[6] XRES P4[0] P4[2] P4[4] P4[6] P2[0] P2[2] P2[4] P2[6] P0[0] P0[2] P0[4] P0[6] Vdd
Direct switched capacitor block input. Direct switched capacitor block input.
SSOP
Switch Mode Pump (SMP) connection to external components required.
I2C Serial Clock (SCL) I2C Serial Data (SDA) Crystal Input (XTALin), I2C Serial Clock (SCL) Ground connection. Crystal Output (XTALout), I2C Serial Data (SDA) Optional External Clock Input (EXTCLK)
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25
Vdd P0[6], AI P0[2], AIO P0[4], AIO P0[0], AI P2[6], External VRef P2[4], External AGND P2[2], AI P2[0], AI P4[6] P4[4] P4[2] P4[0] XRES P3[6] P3[4] P3[2] P3[0] P5[2] P5[0] P1[6] P1[4], EXTCLK P1[2] P1[0], XTALout, I2C SDA
Active high external reset with internal pull down.
Direct switched capacitor block input. Direct switched capacitor block input. External Analog Ground (AGND) External Voltage Reference (VRef) Analog column mux input. Analog column mux input and column output. Analog column mux input and column output. Analog column mux input. Supply voltage.
LEGEND: A = Analog, I = Input, and O = Output.
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CY8C27x43 Final Data Sheet
1. Pin Information
Table 1-6. 48-Pin Part Pinout (MLF*)
Pin No.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO Power I IO IO I I IO IO I I I IO IO IO IO IO IO IO IO IO IO Input IO IO IO IO IO IO IO IO IO IO Power
Type Digital
IO IO IO IO IO IO Power
I I
P2[3] P2[1] P4[7] P4[5] P4[3] P4[1] SMP P3[7] P3[5] P3[3] P3[1] P5[3] P5[1] P1[7] P1[5] P1[3] P1[1] Vss P1[0] P1[2] P1[4] P1[6] P5[0] P5[2] P3[0] P3[2] P3[4] P3[6] XRES P4[0] P4[2] P4[4] P4[6] P2[0] P2[2] P2[4] P2[6] P0[0] P0[2] P0[4] P0[6] Vdd P0[7] P0[5] P0[3] P0[1] P2[7] P2[5]
Direct switched capacitor block input. Direct switched capacitor block input.
P0[3], AIO P0[5], AIO P0[7], AI P2[5] P2[7] P0[1], AI
48 47 46 45 44 43
42 41 40 39
38 37
Vdd P0[6], AI P0[4], AIO P0[2], AIO P0[0], AI P2[6], External VRef
Analog
Pin Name
Description
CY8C27643 48-Pin PSoC Device
Switch Mode Pump (SMP) connection to external components required.
I2C Serial Clock (SCL) I2C Serial Data (SDA) Crystal Input (XTALin), I2C Serial Clock (SCL) Ground connection. Crystal Output (XTALout), I2C Serial Data (SDA) Optional External Clock Input (EXTCLK)
13 14
15 16
Active high external reset with internal pull down.
Direct switched capacitor block input. Direct switched capacitor block input. External Analog Ground (AGND) External Voltage Reference (VRef) Analog column mux input. Analog column mux input and column output. Analog column mux input and column output. Analog column mux input. Supply voltage. Analog column mux input. Analog column mux input and column output. Analog column mux input and column output. Analog column mux input.
LEGEND: A = Analog, I = Input, and O = Output.
* The MLF package has a center pad that must be connected to ground (Vss).
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I2C SCL, XTALin, P1[1] Vss I2C SDA, XTALout, P1[0] P1[2] EXTCLK, P1[4] P1[6] P5[0] P5[2]
P5[1] I2C SCL, P1[7]
I2C SDA, P1[5] P1[3]
17 18 19 20 21 22 23 24
AI, P2[3] AI, P2[1] P4[7] P4[5] P4[3] P4[1] SMP P3[7] P3[5] P3[3] P3[1] P5[3]
1 2 3 4 5 6
MLF
(Top View)
7 8 9 10 11 12
36 35 34 33 32 31 30 29 28 27 26 25
P2[4], External AGND P2[2], AI P2[0], AI P4[6] P4[4] P4[2] P4[0] XRES P3[6] P3[4] P3[2] P3[0]
13
2. Register Reference
This chapter lists the registers of the CY8C27x43 PSoC device. For detailed register information, reference the PSoCTM Mixed Signal Array Technical Reference Manual.
2.1
Register Conventions
2.2
Register Mapping Tables
The register conventions specific to this section are listed in the following table.
Convention Description
R W L C #
Read register or bit(s) Write register or bit(s) Logical register or bit(s) Clearable register or bit(s) Access is bit specific
The PSoC device has a total register address space of 512 bytes. The register space is referred to as IO space and is divided into two banks. The XOI bit in the Flag register (CPU_F) determines which bank the user is currently in. When the XOI bit is set the user is in bank 1.
Note In the following register mapping tables, blank fields are reserved and should not be accessed.
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CY8C27x43 Final Data Sheet
2. Register Reference
Register Map Bank 0 Table: User Space
Access Access Access Access Addr (0,Hex) Addr (0,Hex) Addr (0,Hex) Addr (0,Hex) Name Name Name Name
PRT0DR PRT0IE PRT0GS PRT0DM2 PRT1DR PRT1IE PRT1GS PRT1DM2 PRT2DR PRT2IE PRT2GS PRT2DM2 PRT3DR PRT3IE PRT3GS PRT3DM2 PRT4DR PRT4IE PRT4GS PRT4DM2 PRT5DR PRT5IE PRT5GS PRT5DM2
00 RW 40 01 RW 41 02 RW 42 03 RW 43 04 RW 44 05 RW 45 06 RW 46 07 RW 47 08 RW 48 09 RW 49 0A RW 4A 0B RW 4B 0C RW 4C 0D RW 4D 0E RW 4E 0F RW 4F 10 RW 50 11 RW 51 12 RW 52 13 RW 53 14 RW 54 15 RW 55 16 RW 56 17 RW 57 18 58 19 59 1A 5A 1B 5B 1C 5C 1D 5D 1E 5E 1F 5F DBB00DR0 20 # AMX_IN 60 RW DBB00DR1 21 W 61 DBB00DR2 22 RW 62 DBB00CR0 23 # ARF_CR 63 RW DBB01DR0 24 # CMP_CR0 64 # DBB01DR1 25 W ASY_CR 65 # DBB01DR2 26 RW CMP_CR1 66 RW DBB01CR0 27 # 67 DCB02DR0 28 # 68 DCB02DR1 29 W 69 DCB02DR2 2A RW 6A DCB02CR0 2B # 6B DCB03DR0 2C # 6C DCB03DR1 2D W 6D DCB03DR2 2E RW 6E DCB03CR0 2F # 6F DBB10DR0 30 # ACB00CR3 70 RW DBB10DR1 31 W ACB00CR0 71 RW DBB10DR2 32 RW ACB00CR1 72 RW DBB10CR0 33 # ACB00CR2 73 RW DBB11DR0 34 # ACB01CR3 74 RW DBB11DR1 35 W ACB01CR0 75 RW DBB11DR2 36 RW ACB01CR1 76 RW DBB11CR0 37 # ACB01CR2 77 RW DCB12DR0 38 # ACB02CR3 78 RW DCB12DR1 39 W ACB02CR0 79 RW DCB12DR2 3A RW ACB02CR1 7A RW DCB12CR0 3B # ACB02CR2 7B RW DCB13DR0 3C # ACB03CR3 7C RW DCB13DR1 3D W ACB03CR0 7D RW DCB13DR2 3E RW ACB03CR1 7E RW DCB13CR0 3F # ACB03CR2 7F RW Blank fields are Reserved and should not be accessed.
ASC10CR0 ASC10CR1 ASC10CR2 ASC10CR3 ASD11CR0 ASD11CR1 ASD11CR2 ASD11CR3 ASC12CR0 ASC12CR1 ASC12CR2 ASC12CR3 ASD13CR0 ASD13CR1 ASD13CR2 ASD13CR3 ASD20CR0 ASD20CR1 ASD20CR2 ASD20CR3 ASC21CR0 ASC21CR1 ASC21CR2 ASC21CR3 ASD22CR0 ASD22CR1 ASD22CR2 ASD22CR3 ASC23CR0 ASC23CR1 ASC23CR2 ASC23CR3
80 81 82 83 84 85 86 87 88 89 8A 8B 8C 8D 8E 8F 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9E 9F A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF RDI0RI B0 RDI0SYN B1 RDI0IS B2 RDI0LT0 B3 RDIOLT1 B4 RDI0RO0 B5 RDI0RO1 B6 B7 RDI1RI B8 RDI1SYN B9 RDI1IS BA RDI1LT0 BB RDI1LT1 BC RDI1RO0 BD RDI1RO1 BE BF # Access is bit specific.
RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW
I2C_CFG I2C_SCR I2C_DR I2C_MSCR INT_CLR0 INT_CLR1 INT_CLR3 INT_MSK3 INT_MSK0 INT_MSK1 INT_VC RES_WDT DEC_DH DEC_DL DEC_CR0 DEC_CR1 MUL_X MUL_Y MUL_DH MUL_DL ACC_DR1 ACC_DR0 ACC_DR3 ACC_DR2
RW RW RW RW RW RW RW CPU_F RW RW RW RW RW RW RW
CPU_SCR1 CPU_SCR0
C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF
RW # RW # RW RW RW RW RW RW RC W RC RC RW RW W W R R RW RW RW RW
RL
# #
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CY8C27x43 Final Data Sheet
2. Register Reference
Register Map Bank 1 Table: Configuration Space
Access Access Access Access Addr (1,Hex) Addr (1,Hex) Addr (1,Hex) Addr (1,Hex) Name Name Name Name
00 RW 40 01 RW 41 02 RW 42 03 RW 43 04 RW 44 05 RW 45 06 RW 46 07 RW 47 08 RW 48 09 RW 49 0A RW 4A 0B RW 4B 0C RW 4C 0D RW 4D 0E RW 4E 0F RW 4F 10 RW 50 11 RW 51 12 RW 52 13 RW 53 14 RW 54 15 RW 55 16 RW 56 17 RW 57 18 58 19 59 1A 5A 1B 5B 1C 5C 1D 5D 1E 5E 1F 5F DBB00FN 20 RW CLK_CR0 60 RW DBB00IN 21 RW CLK_CR1 61 RW DBB00OU 22 RW ABF_CR0 62 RW 23 AMD_CR0 63 RW DBB01FN 24 RW 64 DBB01IN 25 RW 65 DBB01OU 26 RW AMD_CR1 66 RW 27 ALT_CR0 67 RW DCB02FN 28 RW ALT_CR1 68 RW DCB02IN 29 RW CLK_CR2 69 RW DCB02OU 2A RW 6A 2B 6B DCB03FN 2C RW 6C DCB03IN 2D RW 6D DCB03OU 2E RW 6E 2F 6F DBB10FN 30 RW ACB00CR3 70 RW DBB10IN 31 RW ACB00CR0 71 RW DBB10OU 32 RW ACB00CR1 72 RW 33 ACB00CR2 73 RW DBB11FN 34 RW ACB01CR3 74 RW DBB11IN 35 RW ACB01CR0 75 RW DBB11OU 36 RW ACB01CR1 76 RW 37 ACB01CR2 77 RW DCB12FN 38 RW ACB02CR3 78 RW DCB12IN 39 RW ACB02CR0 79 RW DCB12OU 3A RW ACB02CR1 7A RW 3B ACB02CR2 7B RW DCB13FN 3C RW ACB03CR3 7C RW DCB13IN 3D RW ACB03CR0 7D RW DCB13OU 3E RW ACB03CR1 7E RW 3F ACB03CR2 7F RW Blank fields are Reserved and should not be accessed.
PRT0DM0 PRT0DM1 PRT0IC0 PRT0IC1 PRT1DM0 PRT1DM1 PRT1IC0 PRT1IC1 PRT2DM0 PRT2DM1 PRT2IC0 PRT2IC1 PRT3DM0 PRT3DM1 PRT3IC0 PRT3IC1 PRT4DM0 PRT4DM1 PRT4IC0 PRT4IC1 PRT5DM0 PRT5DM1 PRT5IC0 PRT5IC1
80 81 82 83 84 85 86 87 88 89 8A 8B 8C 8D 8E 8F 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9E 9F A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF RDI0RI B0 RDI0SYN B1 RDI0IS B2 RDI0LT0 B3 RDIOLT1 B4 RDI0RO0 B5 RDI0RO1 B6 B7 RDI1RI B8 RDI1SYN B9 RDI1IS BA RDI1LT0 BB RDI1LT1 BC RDI1RO0 BD RDI1RO1 BE BF # Access is bit specific.
ASC10CR0 ASC10CR1 ASC10CR2 ASC10CR3 ASD11CR0 ASD11CR1 ASD11CR2 ASD11CR3 ASC12CR0 ASC12CR1 ASC12CR2 ASC12CR3 ASD13CR0 ASD13CR1 ASD13CR2 ASD13CR3 ASD20CR0 ASD20CR1 ASD20CR2 ASD20CR3 ASC21CR0 ASC21CR1 ASC21CR2 ASC21CR3 ASD22CR0 ASD22CR1 ASD22CR2 ASD22CR3 ASC23CR0 ASC23CR1 ASC23CR2 ASC23CR3
RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW RW
RW RW RW RW RW RW RW RW RW RW RW RW RW RW
C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF GDI_O_IN D0 GDI_E_IN D1 GDI_O_OU D2 GDI_E_OU D3 D4 D5 D6 D7 D8 D9 DA DB DC OSC_GO_EN DD OSC_CR4 DE OSC_CR3 DF OSC_CR0 E0 OSC_CR1 E1 OSC_CR2 E2 VLT_CR E3 VLT_CMP E4 E5 E6 E7 IMO_TR E8 ILO_TR E9 BDG_TR EA ECO_TR EB EC ED EE EF F0 F1 F2 F3 F4 F5 F6 CPU_F F7 F8 F9 FA FB FC FD CPU_SCR1 FE CPU_SCR0 FF
RW RW RW RW
RW RW RW RW RW RW RW R
W W RW W
RL
# #
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3. Electrical Specifications
This chapter presents the DC and AC electrical specifications of the CY8C27x43 PSoC device. For the most up to date electrical specifications, confirm that you have the most recent data sheet by going to the web at http://www.cypress.com/psoc. Specifications are valid for -40oC TA 85oC and TJ 100oC, except where noted. Specifications for devices running at greater than 12 MHz are valid for -40oC TA 70oC and TJ 82oC.
5.25
4.75
Vdd Voltage
O
lid n g Va ti ra n pe gi o e R
3.00
93 kHz
CPU Frequency
12 MHz
24 MHz
Figure 3-1. Voltage versus CPU Frequency
The following table lists the units of measure that are used in this chapter.
Table 3-1: Units of Measure
Symbol
o
Unit of Measure
Symbol
W
Unit of Measure
C
degree Celsius decibels femto farad hertz 1024 bytes 1024 bits kilohertz kilohm megahertz megaohm micro ampere micro farad micro henry microsecond micro volts micro volts root-mean-square
micro watts milli-ampere milli-second milli-volts nano ampere nanosecond nanovolts ohm pico ampere pico farad peak-to-peak parts per million picosecond samples per second sigma: one standard deviation volts
dB fF Hz KB Kbit kHz k MHz M
A F H s V Vrms
mA ms mV nA ns nV
pA pF pp ppm ps sps
V
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CY8C27x43 Final Data Sheet
3. Electrical Specifications
3.1
Symbol
Absolute Maximum Ratings
Description Min Typ Max Units
oC o
Table 3-2. Absolute Maximum Ratings
Notes
TSTG TA Vdd VIO - IMIO IMAIO ESD -
Storage Temperature Ambient Temperature with Power Applied Supply Voltage on Vdd Relative to Vss DC Input Voltage DC Voltage Applied to Tri-state Maximum Current into any Port Pin Maximum Current into any Port Pin Configured as Analog Driver Electro Static Discharge Voltage Latch-up Current
-55 -40 -0.5 Vss- 0.5 Vss - 0.5 -25 -50 2000 -
- - - - - - - - -
+100 +85 +6.0 Vdd + 0.5 Vdd + 0.5 +50 +50 - 200
Higher storage temperatures will reduce data retention time.
C
V V V mA mA V mA Human Body Model ESD
3.2
Symbol
Operating Temperature
Description Min Typ Max Units
oC oC
Table 3-3. Operating Temperature
Notes
TA TJ
Ambient Temperature Junction Temperature
-40 -40
- -
+85 +100
The temperature rise from ambient to junction is package specific. See "Thermal Impedances" on page 41. The user must limit the power consumption to comply with this requirement.
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CY8C27x43 Final Data Sheet
3. Electrical Specifications
3.3
3.3.1
DC Electrical Characteristics
DC Chip-Level Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only.
Table 3-4. DC Chip-Level Specifications
Symbol Description Min Typ Max Units Notes
Vdd IDD
Supply Voltage Supply Current
3.00 -
- 5
5.25 8
V mA Conditions are Vdd = 5.0V, TA = 25 oC, CPU = 3 MHz, 48 MHz = Disabled. VC1 = 1.5 MHz, VC2 = 93.75 kHz, VC3 = 93.75 kHz. Conditions are Vdd = 3.3V, TA = 25 oC, CPU = 3 MHz, 48 MHz = Disabled, VC1 = 1.5 MHz, VC2 = 93.75 kHz, VC3 = 93.75 kHz. Conditions are with internal slow speed oscillator, Vdd = 3.3V, -40 oC TA 55 oC. Conditions are with internal slow speed oscillator, Vdd = 3.3V, 55 oC < TA 85 oC. Conditions are with properly loaded, 1 W max, 32.768 kHz crystal. Vdd = 3.3V, -40 oC TA 55 oC. Conditions are with properly loaded, 1 W max, 32.768 kHz crystal. Vdd = 3.3V, 55 oC < TA 85
o
IDD3
Supply Current
-
3.3
6.0
mA
ISB ISBH ISBXTL
Sleep (Mode) Current with POR, LVD, Sleep Timer, and WDT.a Sleep (Mode) Current with POR, LVD, Sleep Timer, and WDT at high temperature.a Sleep (Mode) Current with POR, LVD, Sleep Timer, WDT, and external crystal.a Sleep (Mode) Current with POR, LVD, Sleep Timer, WDT, and external crystal at high temperature.a Reference Voltage (Bandgap) for Silicon A
b
- - -
3 4 4
6.5 25 7.5
A A A
ISBXTLH
-
5
26
A
C.
VREF VREF
1.275 1.280
1.300 1.300
1.325 1.320
V V
Trimmed for appropriate Vdd. Trimmed for appropriate Vdd.
Reference Voltage (Bandgap) for Silicon B b
a. Standby current includes all functions (POR, LVD, WDT, Sleep Time) needed for reliable system operation. This should be compared with devices that have similar functions enabled. b. Refer to the Ordering Information chapter on page 42.
3.3.2
DC General Purpose IO Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only.
Table 3-5. DC GPIO Specifications
Symbol Description Min Typ Max Units Notes
RPU RPD VOH
Pull up Resistor Pull down Resistor High Output Level
4 4 Vdd - 1.0
5.6 5.6 -
8 8 -
k k V IOH = 10 mA, Vdd = 4.75 to 5.25V (8 total loads, 4 on even port pins (for example, P0[2], P1[4]), 4 on odd port pins (for example, P0[3], P1[5])). IOL = 25 mA, Vdd = 4.75 to 5.25V (8 total loads, 4 on even port pins (for example, P0[2], P1[4]), 4 on odd port pins (for example, P0[3], P1[5])). Vdd = 3.0 to 5.25 Vdd = 3.0 to 5.25 Gross tested to 1 A. Package and pin dependent. Temp = 25oC. Package and pin dependent. Temp = 25oC.
VOL
Low Output Level
-
-
0.75
V
VIL VIH VH IIL CIN COUT
Input Low Level Input High Level Input Hysterisis Input Leakage (Absolute Value) Capacitive Load on Pins as Input Capacitive Load on Pins as Output
- 2.1 - - - -
- - 60 1 3.5 3.5
0.8
V V
- - 10 10
mV nA pF pF
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3. Electrical Specifications
3.3.3
DC Operational Amplifier Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only. The Operational Amplifier is a component of both the Analog Continuous Time PSoC blocks and the Analog Switched Cap PSoC blocks. The guaranteed specifications are measured in the Analog Continuous Time PSoC block. Typical parameters apply to 5V at 25C and are for design guidance only.
Table 3-6. 5V DC Operational Amplifier Specifications
Symbol Description Min Typ Max Units Notes
VOSOA
Input Offset Voltage (absolute value) Power = Low, Opamp Bias = High Power = Medium, Opamp Bias = High Power = High, Opamp Bias = High - - - - - - 0.0 0.5 1.6 1.3 1.2 7.0 20 4.5 - - 10 8 7.5 35.0 - 9.5 Vdd Vdd - 0.5 mV mV mV
V/oC
TCVOSOA IEBOA CINOA VCMOA
Average Input Offset Voltage Drift Input Leakage Current (Port 0 Analog Pins) Input Capacitance (Port 0 Analog Pins) Common Mode Voltage Range Common Mode Voltage Range (high power or high opamp bias)
pA pF V
Gross tested to 1 A. Package and pin dependent. Temp = 25oC. The common-mode input voltage range is measured through an analog output buffer. The specification includes the limitations imposed by the characteristics of the analog output buffer. Specification is applicable at high power. For all other bias modes (except high power, high opamp bias), minimum is 60 dB.
CMRROA
Common Mode Rejection Ratio Power = Low Power = Medium Power = High 60 60 60
-
-
dB
GOLOA
Open Loop Gain Power = Low Power = Medium Power = High 60 60 80 Vdd - 0.2 Vdd - 0.2 Vdd - 0.5 - - - - - - - - - 60
-
-
dB
Specification is applicable at high power. For all other bias modes (except high power, high opamp bias), minimum is 60 dB.
VOHIGHOA
High Output Voltage Swing (internal signals) Power = Low Power = Medium Power = High - - - - - - 150 300 600 1200 2400 4600 - - - - 0.2 0.2 0.5 200 400 800 1600 3200 6400 - V V V V V V
A A A A A A
VOLOWOA
Low Output Voltage Swing (internal signals) Power = Low Power = Medium Power = High
ISOA
Supply Current (including associated AGND buffer) Power = Low, Opamp Bias = Low Power = Low, Opamp Bias = High Power = Medium, Opamp Bias = Low Power = Medium, Opamp Bias = High Power = High, Opamp Bias = Low Power = High, Opamp Bias = High
PSRROA
Supply Voltage Rejection Ratio
dB
0V VIN (Vdd - 2.25) or (Vdd - 1.25V) VIN Vdd.
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3. Electrical Specifications
Table 3-7. 3.3V DC Operational Amplifier Specifications
Symbol Description Min Typ Max Units Notes
VOSOA
Input Offset Voltage (absolute value) Power = Low, Opamp Bias = High Power = Medium, Opamp Bias = High High Power is 5 Volts Only - - - - - 0.2 1.65 1.32 7.0 20 4.5 - 10 8 35.0 - 9.5 Vdd - 0.2 mV mV
V/oC
TCVOSOA IEBOA CINOA VCMOA
Average Input Offset Voltage Drift Input Leakage Current (Port 0 Analog Pins) Input Capacitance (Port 0 Analog Pins) Common Mode Voltage Range
pA pF V
Gross tested to 1 A. Package and pin dependent. Temp = 25oC. The common-mode input voltage range is measured through an analog output buffer. The specification includes the limitations imposed by the characteristics of the analog output buffer. Specification is applicable at high power. For all other bias modes (except high power, high opamp bias), minimum is 60 dB.
CMRROA
Common Mode Rejection Ratio Power = Low Power = Medium Power = High 50 50 50
-
-
dB
GOLOA
Open Loop Gain Power = Low Power = Medium Power = High 60 60 80 Vdd - 0.2 Vdd - 0.2 Vdd - 0.2 - - - - - - - - - 50
-
-
dB
Specification is applicable at high power. For all other bias modes (except high power, high opamp bias), minimum is 60 dB.
VOHIGHOA
High Output Voltage Swing (internal signals) Power = Low Power = Medium Power = High is 5V only - - - - - - 150 300 600 1200 2400 4600 - - - - 0.2 0.2 0.2 200 400 800 1600 3200 6400 - V V V V V V
A A A A A A
VOLOWOA
Low Output Voltage Swing (internal signals) Power = Low Power = Medium Power = High
ISOA
Supply Current (including associated AGND buffer) Power = Low, Opamp Bias = Low Power = Low, Opamp Bias = High Power = Medium, Opamp Bias = Low Power = Medium, Opamp Bias = High Power = High, Opamp Bias = Low Power = High, Opamp Bias = High
PSRROA
Supply Voltage Rejection Ratio
dB
0V VIN (Vdd - 2.25) or (Vdd - 1.25V) VIN Vdd.
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3. Electrical Specifications
3.3.4
DC Analog Output Buffer Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only.
Table 3-8. 5V DC Analog Output Buffer Specifications
Symbol Description Min Typ Max Units Notes
VOSOB TCVOSOB VCMOB ROUTOB
Input Offset Voltage (Absolute Value) Average Input Offset Voltage Drift Common-Mode Input Voltage Range Output Resistance Power = Low Power = High
- - 0.5 - -
3 +6 - 1 1
12 - Vdd - 1.0 - - - -
mV
V/C
V

VOHIGHOB
High Output Voltage Swing (Load = 32 ohms to Vdd/2) Power = Low Power = High
0.5 x Vdd + 1.3 - 0.5 x Vdd + 1.3 -
V V
VOLOWOB
Low Output Voltage Swing (Load = 32 ohms to Vdd/2) Power = Low Power = High - - - - 0.5 x Vdd - 1.3 0.5 x Vdd - 1.3 V V
ISOB
Supply Current Including Bias Cell (No Load) Power = Low Power = High - - 60 1.1 2.6 - 5.1 8.8 - mA mA dB
PSRROB
Supply Voltage Rejection Ratio
Table 3-9. 3.3V DC Analog Output Buffer Specifications
Symbol Description Min Typ Max Units Notes
VOSOB TCVOSOB VCMOB ROUTOB
Input Offset Voltage (Absolute Value) Average Input Offset Voltage Drift Common-Mode Input Voltage Range Output Resistance Power = Low Power = High
- - 0.5 - -
3 +6 1 1
12 - Vdd - 1.0 - - - -
mV
V/C
V

VOHIGHOB
High Output Voltage Swing (Load = 1k ohms to Vdd/2) Power = Low Power = High 0.5 x Vdd + 1.0 - 0.5 x Vdd + 1.0 - V V
VOLOWOB
Low Output Voltage Swing (Load = 1k ohms to Vdd/2) Power = Low Power = High - - - - 0.5 x Vdd - 1.0 0.5 x Vdd - 1.0 V V
ISOB
Supply Current Including Bias Cell (No Load) Power = Low Power = High - 60 0.8 2.0 - 2.0 4.3 - mA mA dB
PSRROB
Supply Voltage Rejection Ratio
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3. Electrical Specifications
3.3.5
DC Switch Mode Pump Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only.
Table 3-10. DC Switch Mode Pump (SMP) Specifications
Symbol Description Min Typ Max Units Notes
VPUMP 5V VPUMP 3V IPUMP
5V Output Voltage 3V Output Voltage Available Output Current VBAT = 1.5V, VPUMP = 3.25V VBAT = 1.8V, VPUMP = 5.0V
4.75 3.00
5.0 3.25
5.25 3.60
V V
Configuration of footnote a. Average, neglecting ripple. SMP trip voltage is set to 5.0V. Configuration of footnote a. Average, neglecting ripple. SMP trip voltage is set to 3.25V. Configuration of footnote a.
8 5 1.8 1.0 1.1 -
- - - - - 5
- - 5.0 3.3 - -
mA mA V V V %VO
SMP trip voltage is set to 3.25V. SMP trip voltage is set to 5.0V. Configuration of footnote a. SMP trip voltage is set to 5.0V. Configuration of footnote a. SMP trip voltage is set to 3.25V. Configuration of footnote a. Configuration of footnote a. VO is the "Vdd Value for PUMP Trip" specified by the VM[2:0] setting in the DC POR and LVD Specification, Table 3-16 on page 26. Configuration of footnote a. VO is the "Vdd Value for PUMP Trip" specified by the VM[2:0] setting in the DC POR and LVD Specification, Table 3-16 on page 26. Configuration of footnote a. Load is 5mA. Configuration of footnote a. Load is 5 mA. SMP trip voltage is set to 3.25V.
VBAT5V VBAT3V VBATSTART
VPUMP_Line
Input Voltage Range from Battery Input Voltage Range from Battery Minimum Input Voltage from Battery to Start Pump Line Regulation (over VBAT range)
VPUMP_Load
Load Regulation
-
5
-
%VO
VPUMP_Ripple
Output Voltage Ripple (depends on capacitor/load) Efficiency Switching Frequency Switching Duty Cycle
- 35 - -
100 50 1.3 50
- - - -
mVpp % MHz %
E3 FPUMP DCPUMP
a. L1 = 2 H inductor, C1 = 10 F capacitor, D1 = Schottky diode. See Figure 3-2.
D1
Vdd
VPUMP C1
L1 VBAT
+
SMP Battery
PSoCTM
Vss
Figure 3-2. Basic Switch Mode Pump Circuit
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3. Electrical Specifications
3.3.6
DC Analog Reference Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only. The guaranteed specifications are measured through the Analog Continuous Time PSoC blocks. The power levels for AGND refer to the power of the Analog Continuous Time PSoC block. The power levels for RefHi and RefLo refer to the Analog Reference Control register. The limits stated for AGND include the offset error of the AGND buffer local to the Analog Continuous Time PSoC block. Reference control power is high. Table 3-11. Silicon Revision A - 5V DC Analog Reference Specifications
Symbol Description Min Typ Max Units
BG - - - - - - - - - - - - - - - - -
Bandgap Voltage Reference AGND = Vdd/2a AGND = 2 x BandGapa Vdd/2)a
a a
1.274 Vdd/2 - 0.030 2 x BG - 0.043 P2[4] - 0.013 BG - 0.009 1.6 x BG - 0.018 -0.034
1.30 Vdd/2 - 0.004 2 x BG - 0.010 P2[4] BG 1.6 x BG 0.000
1.326 Vdd/2 + 0.003 2 x BG + 0.024 P2[4] + 0.014 BG + 0.009 1.6 x BG + 0.018 0.034
V V V V V V V V V V V V V V V V V V
AGND = P2[4] (P2[4] = AGND = BandGapa
AGND = 1.6 x BandGap
AGND Block to Block Variation (AGND = Vdd/2) RefHi = Vdd/2 + BandGap RefHi = 3 x BandGap RefHi = 2 x BandGap + P2[6] (P2[6] = 1.3V) RefHi = P2[4] + BandGap (P2[4] = Vdd/2)
Vdd/2 + BG - 0.140
3 x BG - 0.112 2 x BG + P2[6] - 0.113 P2[4] + BG - 0.130 P2[4] + P2[6] - 0.133 3.2 x BG - 0.112
Vdd/2 + BG - 0.018
3 x BG - 0.018 2 x BG + P2[6] - 0.018 P2[4] + BG - 0.016 P2[4] + P2[6] - 0.016 3.2 x BG
Vdd/2 + BG + 0.103
3 x BG + 0.076 2 x BG + P2[6] + 0.077 P2[4] + BG + 0.098 P2[4] + P2[6] + 0.100 3.2 x BG + 0.076
RefHi = P2[4] + P2[6] (P2[4] = Vdd/2, P2[6] = 1.3V) RefHi = 3.2 x BandGap RefLo = Vdd/2 - BandGap RefLo = BandGap RefLo = 2 x BandGap - P2[6] (P2[6] = 1.3V) RefLo = P2[4] - BandGap (P2[4] = Vdd/2) RefLo = P2[4]-P2[6] (P2[4] = Vdd/2, P2[6] = 1.3V)
Vdd/2 - BG - 0.051
BG - 0.082 2 x BG - P2[6] - 0.084 P2[4] - BG - 0.056 P2[4] - P2[6] - 0.057
Vdd/2 - BG + 0.024
BG + 0.023 2 x BG - P2[6] + 0.025 P2[4] - BG + 0.026 P2[4] - P2[6] + 0.026
Vdd/2 - BG + 0.098
BG + 0.129 2 x BG - P2[6] + 0.134 P2[4] - BG + 0.107 P2[4] - P2[6] + 0.110
a. AGND tolerance includes the offsets of the local buffer in the PSoC block.
Table 3-12. Silicon Revision B - 5V DC Analog Reference Specifications
Symbol Description Min Typ Max Units
BG - - - - - - - - - - - - - - - - -
Bandgap Voltage Reference AGND = Vdd/2a AGND = 2 x BandGapa AGND = P2[4] (P2[4] = AGND = BandGap
a a
1.28 Vdd/2 - 0.030 2 x BG - 0.043
1.30 Vdd/2 2 x BG P2[4] BG 1.6 x BG 0.000
1.32 Vdd/2 + 0.007 2 x BG + 0.024 P2[4] + 0.011 BG + 0.009 1.6 x BG + 0.018 0.034
V V V V V V V V V V V V V V V V V V
Vdd/2)a
P2[4] - 0.011 BG - 0.009 1.6 x BG - 0.018 Vdd/2)a -0.034
AGND = 1.6 x BandGap
AGND Block to Block Variation (AGND = RefHi = Vdd/2 + BandGap RefHi = 3 x BandGap
Vdd/2 + BG - 0.1
3 x BG - 0.06 2 x BG + P2[6] - 0.06 P2[4] + BG - 0.06 P2[4] + P2[6] - 0.06 3.2 x BG - 0.06
Vdd/2 + BG - 0.01
3 x BG - 0.01 2 x BG + P2[6] - 0.01 P2[4] + BG - 0.01 P2[4] + P2[6] - 0.01 3.2 x BG - 0.01
Vdd/2 + BG + 0.1
3 x BG + 0.06 2 x BG + P2[6] + 0.06 P2[4] + BG + 0.06 P2[4] + P2[6] + 0.06 3.2 x BG + 0.06
RefHi = 2 x BandGap + P2[6] (P2[6] = 1.3V) RefHi = P2[4] + BandGap (P2[4] = Vdd/2) RefHi = P2[4] + P2[6] (P2[4] = Vdd/2, P2[6] = 1.3V) RefHi = 3.2 x BandGap RefLo = Vdd/2 - BandGap RefLo = BandGap RefLo = 2 x BandGap - P2[6] (P2[6] = 1.3V) RefLo = P2[4] - BandGap (P2[4] = Vdd/2) RefLo = P2[4]-P2[6] (P2[4] = Vdd/2, P2[6] = 1.3V)
Vdd/2 - BG - 0.051
BG - 0.06 2 x BG - P2[6] - 0.04 P2[4] - BG - 0.056 P2[4] - P2[6] - 0.056
Vdd/2 - BG + 0.01
BG + 0.01 2 x BG - P2[6] + 0.01 P2[4] - BG + 0.01 P2[4] - P2[6] + 0.01
Vdd/2 - BG + 0.06
BG + 0.06 2 x BG - P2[6] + 0.04 P2[4] - BG + 0.056 P2[4] - P2[6] + 0.056
a. AGND tolerance includes the offsets of the local buffer in the PSoC block.
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3. Electrical Specifications
Table 3-13. Silicon Revision A - 3.3V DC Analog Reference Specifications
Symbol Description Min Typ Max Units
BG - - - - - - - - - - - - - - - - -
Bandgap Voltage Reference AGND = Vdd/2a AGND = 2 x BandGap AGND = BandGapa
a a
1.274 Vdd/2 - 0.027 Not Allowed P2[4] - 0.008 BG - 0.009 1.6 x BG - 0.018 Vdd/2)a -0.034 Not Allowed Not Allowed Not Allowed Not Allowed P2[4] + P2[6] - 0.075 Not Allowed Not Allowed Not Allowed Not Allowed Not Allowed P2[4] - P2[6] - 0.048
1.30 Vdd/2 - 0.003
1.326 Vdd/2 + 0.002
V V
AGND = P2[4] (P2[4] = Vdd/2)
P2[4] + 0.001 BG 1.6 x BG 0.000
P2[4] + 0.009 BG + 0.009 1.6 x BG + 0.018 0.034
V V V mV
AGND = 1.6 x BandGap
AGND Block to Block Variation (AGND = RefHi = Vdd/2 + BandGap RefHi = 3 x BandGap
RefHi = 2 x BandGap + P2[6] (P2[6] = 0.5V) RefHi = P2[4] + BandGap (P2[4] = Vdd/2) RefHi = P2[4] + P2[6] (P2[4] = Vdd/2, P2[6] = 0.5V) RefHi = 3.2 x BandGap RefLo = Vdd/2 - BandGap RefLo = BandGap RefLo = 2 x BandGap - P2[6] (P2[6] = 0.5V) RefLo = P2[4] - BandGap (P2[4] = Vdd/2) RefLo = P2[4]-P2[6] (P2[4] = Vdd/2, P2[6] = 0.5V)
P2[4] + P2[6] - 0.009
P2[4] + P2[6] + 0.057
V
P2[4] - P2[6] + 0.022
P2[4] - P2[6] + 0.092
V
a. AGND tolerance includes the offsets of the local buffer in the PSoC block. Note See Application Note AN2012 "Adjusting PSoC Microcontroller Trims for Dual Voltage-Range Operation" for information on trimming for operation at 3.3V.
Table 3-14. Silicon Revision B - 3.3V DC Analog Reference Specifications
Symbol Description Min Typ Max Units
BG - - - - - - - - - - - - - - - - -
Bandgap Voltage Reference AGND = Vdd/2a AGND = 2 x AGND = BandGapa AGND = P2[4] (P2[4] = Vdd/2) BandGapa BandGapa Vdd/2)a
1.28 Vdd/2 - 0.027 Not Allowed P2[4] - 0.008 BG - 0.009 1.6 x BG - 0.018 -0.034 Not Allowed Not Allowed Not Allowed Not Allowed P2[4] + P2[6] - 0.06 Not Allowed Not Allowed Not Allowed Not Allowed Not Allowed P2[4] - P2[6] - 0.048
1.30 Vdd/2
1.32 Vdd/2 + 0.005
V V
P2[4] BG 1.6 x BG 0.000
P2[4] + 0.009 BG + 0.009 1.6 x BG + 0.018 0.034
V V V mV
AGND = 1.6 x
AGND Block to Block Variation (AGND = RefHi = Vdd/2 + BandGap RefHi = 3 x BandGap
RefHi = 2 x BandGap + P2[6] (P2[6] = 0.5V) RefHi = P2[4] + BandGap (P2[4] = Vdd/2) RefHi = P2[4] + P2[6] (P2[4] = Vdd/2, P2[6] = 0.5V) RefHi = 3.2 x BandGap RefLo = Vdd/2 - BandGap RefLo = BandGap RefLo = 2 x BandGap - P2[6] (P2[6] = 0.5V) RefLo = P2[4] - BandGap (P2[4] = Vdd/2) RefLo = P2[4]-P2[6] (P2[4] = Vdd/2, P2[6] = 0.5V)
P2[4] + P2[6] - 0.01
P2[4] + P2[6] + 0.057
V
P2[4] - P2[6] + 0.01
P2[4] - P2[6] + 0.048
V
a. AGND tolerance includes the offsets of the local buffer in the PSoC block. Note See Application Note AN2012 "Adjusting PSoC Microcontroller Trims for Dual Voltage-Range Operation" for information on trimming for operation at 3.3V.
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3. Electrical Specifications
3.3.7
DC Analog PSoC Block Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only. Table 3-15. DC Analog PSoC Block Specifications
Symbol Description Min Typ Max Units Notes
RCT CSC
Resistor Unit Value (Continuous Time) Capacitor Unit Value (Switch Cap)
- -
12.2 80
- -
k fF
3.3.8
DC POR and LVD Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only. Note The bits PORLEV and VM in the table below refer to bits in the VLT_CR register. See the PSoC Mixed Signal Array Technical Reference Manual for more information on the VLT_CR register. Table 3-16. DC POR and LVD Specifications
Symbol Description Min Typ Max Units Notes
Vdd Value for PPOR Trip (positive ramp) VPPOR0R VPPOR1R VPPOR2R VPPOR0 VPPOR1 VPPOR2 VPH0 VPH1 VPH2 VLVD0 VLVD1 VLVD2 VLVD3 VLVD4 VLVD5 VLVD6 VLVD7 PORLEV[1:0] = 00b PORLEV[1:0] = 01b PORLEV[1:0] = 10b Vdd Value for PPOR Trip (negative ramp) PORLEV[1:0] = 00b PORLEV[1:0] = 01b PORLEV[1:0] = 10b PPOR Hysteresis PORLEV[1:0] = 00b PORLEV[1:0] = 01b PORLEV[1:0] = 10b Vdd Value for LVD Trip VM[2:0] = 000b VM[2:0] = 001b VM[2:0] = 010b VM[2:0] = 011b VM[2:0] = 100b VM[2:0] = 101b VM[2:0] = 110b VM[2:0] = 111b Vdd Value for PUMP Trip VPUMP0 VPUMP1 VPUMP2 VPUMP3 VPUMP4 VPUMP5 VPUMP6 VPUMP7 VM[2:0] = 000b VM[2:0] = 001b VM[2:0] = 010b VM[2:0] = 011b VM[2:0] = 100b VM[2:0] = 101b VM[2:0] = 110b VM[2:0] = 111b 2.96 3.03 3.18 4.11 4.55 4.63 4.72 4.90 3.02 3.10 3.25 4.19 4.64 4.73 4.82 5.00 3.08 3.16 3.32 4.28 4.74 4.82 4.91 5.10 V V V V V V V V V 2.86 2.96 3.07 3.92 4.39 4.55 4.63 4.72 2.92 3.02 3.13 4.00 4.48 4.64 4.73 4.81 2.98a 3.08 3.20 4.08 4.57 4.74b 4.82 4.91 V V V V V V V V V - - - 92 0 0 - - - mV mV mV - 2.82 4.39 4.55 - V V V - 2.91 4.39 4.55 - V V V
a. Always greater than 50 mV above PPOR (PORLEV = 00) for falling supply. b. Always greater than 50 mV above PPOR (PORLEV = 10) for falling supply.
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3. Electrical Specifications
3.3.9
DC Programming Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only. Table 3-17. DC Programming Specifications
Symbol Description Min Typ Max Units Notes
IDDP VILP VIHP IILP IIHP VOLV VOHV FlashENPB FlashENT FlashDR
Supply Current During Programming or Verify Input Low Voltage During Programming or Verify Input High Voltage During Programming or Verify Input Current when Applying Vilp to P1[0] or P1[1] During Programming or Verify Input Current when Applying Vihp to P1[0] or P1[1] During Programming or Verify Output Low Voltage During Programming or Verify Output High Voltage During Programming or Verify Flash Endurance (per block) Flash Endurance (total)a
- - 2.2 - - - Vdd - 1.0 50,000 1,800,000 10
5 - - - - - - - - -
25 0.8 - 0.2 1.5
mA V V mA mA Driving internal pull-down resistor. Driving internal pull-down resistor.
Vss + 0.75 V Vdd - - - V - - Years Erase/write cycles per block. Erase/write cycles.
Flash Data Retention
a. A maximum of 36 x 50,000 block endurance cycles is allowed. This may be balanced between operations on 36x1 blocks of 50,000 maximum cycles each, 36x2 blocks of 25,000 maximum cycles each, or 36x4 blocks of 12,500 maximum cycles each (to limit the total number of cycles to 36x50,000 and that no single block ever sees more than 50,000 cycles). For the full industrial range, the user must employ a temperature sensor user module (FlashTemp) and feed the result to the temperature argument before writing. Refer to the Flash APIs Application Note AN2015 at http://www.cypress.com under Application Notes for more information.
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3. Electrical Specifications
3.4
3.4.1
AC Electrical Characteristics
AC Chip-Level Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only. Table 3-18. AC Chip-Level Specifications
Symbol Description Min Typ Max Units Notes
FIMO FCPU1 FCPU2 F48M F24M F32K1 F32K2 FPLL Jitter24M2 TPLLSLEW TPLLSLEWSLOW
Internal Main Oscillator Frequency CPU Frequency (5V Nominal) CPU Frequency (3.3V Nominal) Digital PSoC Block Frequency Digital PSoC Block Frequency Internal Low Speed Oscillator Frequency External Crystal Oscillator PLL Frequency 24 MHz Period Jitter (PLL) PLL Lock Time PLL Lock Time for Low Gain Setting External Crystal Oscillator Startup to 1% External Crystal Oscillator Startup to 100 ppm
23.4 0.93 0.93 0 0 15 - - - 0.5 0.5 - -
24 24 12 48 24 32 32.768 23.986 - - - 1700 2800
24.6a 24.6a,b 12.3b,c 49.2a,b,d 24.6b, d 64 - - 600 10 50 2620 3800
MHz MHz MHz MHz MHz kHz kHz MHz ps ms ms ms ms
Trimmed. Utilizing factory trim values. Trimmed. Utilizing factory trim values. Trimmed. Utilizing factory trim values. Refer to the AC Digital Block Specifications below.
Accuracy is capacitor and crystal dependent. 50% duty cycle. Multiple (x732) of crystal frequency.
TOS TOSACC
The crystal oscillator frequency is within 100 ppm of its final value by the end of the Tosacc period. Correct operation assumes a properly loaded 1 uW maximum drive level 32.768 kHz crystal. 3.0V Vdd 5.5V, -40 o C TA 85 oC.
Jitter32k TXRST DC24M Step24M Fout48M Jitter24M1 FMAX TRAMP
32 kHz Period Jitter External Reset Pulse Width 24 MHz Duty Cycle 24 MHz Trim Step Size 48 MHz Output Frequency 24 MHz Period Jitter (IMO) Maximum frequency of signal on row input or row output. Supply Ramp Time
- 10 40 - 46.8 - - 0
100 - 50 50 48.0 600 - - 12.3 - - 60 - 49.2a,c
ns
s
% kHz MHz ps MHz
s
Trimmed. Utilizing factory trim values.
a. b. c. d.
4.75V < Vdd < 5.25V. Accuracy derived from Internal Main Oscillator with appropriate trim for Vdd range. 3.0V < Vdd < 3.6V. See Application Note AN2012 "Adjusting PSoC Microcontroller Trims for Dual Voltage-Range Operation" for information on trimming for operation at 3.3V. See the individual user module data sheets for information on maximum frequencies for user modules.
PLL Enable
TPLLSLEW 24 MHz
FPLL PLL Gain
0
Figure 3-3. PLL Lock Timing Diagram
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3. Electrical Specifications
PLL Enable
TPLLSLEWLOW 24 MHz
FPLL PLL Gain
1
Figure 3-4. PLL Lock for Low Gain Setting Timing Diagram
32K Select
TOS
32 kHz
F32K2
Figure 3-5. External Crystal Oscillator Startup Timing Diagram
Jitter24M1
F24M
Figure 3-6. 24 MHz Period Jitter (IMO) Timing Diagram
Jitter32k
F32K2
Figure 3-7. 32 kHz Period Jitter (ECO) Timing Diagram
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3. Electrical Specifications
3.4.2
AC General Purpose IO Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only. Table 3-19. AC GPIO Specifications
Symbol Description Min Typ Max Units Notes
FGPIO TRiseF TFallF TRiseS TFallS
GPIO Operating Frequency Rise Time, Normal Strong Mode, Cload = 50 pF Fall Time, Normal Strong Mode, Cload = 50 pF Rise Time, Slow Strong Mode, Cload = 50 pF Fall Time, Slow Strong Mode, Cload = 50 pF
0 3 2 10 10
- - - 27 22
12 18 18 - -
MHz ns ns ns ns Vdd = 4.5 to 5.25V, 10% - 90% Vdd = 4.5 to 5.25V, 10% - 90% Vdd = 3 to 5.25V, 10% - 90% Vdd = 3 to 5.25V, 10% - 90%
90% GPIO Pin Output Voltage 10%
TRiseF TRiseS
TFallF TFallS
Figure 3-8. GPIO Timing Diagram
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3. Electrical Specifications
3.4.3
AC Operational Amplifier Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only. Settling times, slew rates, and gain bandwidth are based on the Analog Continuous Time PSoC block. Power = High and Opamp Bias = High is not supported at 3.3V. Table 3-20. 5V AC Operational Amplifier Specifications
Symbol Description Min Typ Max Units Notes
TROA
Rising Settling Time from 80% of V to 0.1% of V (10 pF load, Unity Gain) Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High Power = High, Opamp Bias = High - - - - - - 3.9 0.72 0.62
s s s
TSOA
Falling Settling Time from 20% of V to 0.1% of V (10 pF load, Unity Gain) Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High Power = High, Opamp Bias = High - - - 0.15 1.7 6.5 0.01 0.5 4.0 0.75 3.1 5.4 - - - - - - - - - - - - - 100 5.9 0.92 0.72 - - - - - - - - - -
s s s
SRROA
Rising Slew Rate (20% to 80%)(10 pF load, Unity Gain) Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High Power = High, Opamp Bias = High V/s V/s V/s V/s V/s V/s MHz MHz MHz nV/rt-Hz
SRFOA
Falling Slew Rate (20% to 80%)(10 pF load, Unity Gain) Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High Power = High, Opamp Bias = High
BWOA
Gain Bandwidth Product Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High Power = High, Opamp Bias = High
ENOA
Noise at 1 kHz (Power = Medium, Opamp Bias = High)
Table 3-21. 3.3V AC Operational Amplifier Specifications
Symbol Description Min Typ Max Units Notes
TROA
Rising Settling Time from 80% of V to 0.1% of V (10 pF load, Unity Gain) Power = Low, Opamp Bias = Low Power = Low, Opamp Bias = High - - - - 3.92 0.72
s s
TSOA
Falling Settling Time from 20% of V to 0.1% of V (10 pF load, Unity Gain) Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High - - 0.31 2.7 0.24 1.8 0.67 2.8 - - - - - - - - - 100 5.41 0.72 - - - - - - -
s s
SRROA
Rising Slew Rate (20% to 80%)(10 pF load, Unity Gain) Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High V/s V/s V/s V/s MHz MHz nV/rt-Hz
SRFOA
Falling Slew Rate (20% to 80%)(10 pF load, Unity Gain) Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High
BWOA
Gain Bandwidth Product Power = Low, Opamp Bias = Low Power = Medium, Opamp Bias = High
ENOA
Noise at 1 kHz (Power = Medium, Opamp Bias = High)
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3. Electrical Specifications
3.4.4
AC Digital Block Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only. Table 3-22. AC Digital Block Specifications
Function Description Min Typ Max Units Notes
All Functions Timer
Maximum Block Clocking Frequency (> 4.75V) Maximum Block Clocking Frequency (< 4.75V) Capture Pulse Width Maximum Frequency, No Capture Maximum Frequency, With Capture 50a - - 50a - - 20 50a 50 - - - - - 50a - -
a
49.2 24.6 - - - - - - - - - - - - - - - - 49.2 24.6 - 49.2 24.6 - - - 49.2 49.2 24.6 8.2 4.1 - ns MHz MHz ns MHz MHz ns ns ns MHz MHz MHz MHz ns ns
4.75V < Vdd < 5.25V. 3.0V < Vdd < 4.75V.
4.75V < Vdd < 5.25V.
Counter
Enable Pulse Width Maximum Frequency, No Enable Input Maximum Frequency, Enable Input
4.75V < Vdd < 5.25V.
Dead Band
Kill Pulse Width: Asynchronous Restart Mode Synchronous Restart Mode Disable Mode Maximum Frequency
4.75V < Vdd < 5.25V. 4.75V < Vdd < 5.25V.
CRCPRS Maximum Input Clock Frequency (PRS Mode) CRCPRS Maximum Input Clock Frequency (CRC Mode) SPIM SPIS Maximum Input Clock Frequency Maximum Input Clock Frequency Width of SS_ Negated Between Transmissions Transmitter Maximum Input Clock Frequency Silicon A Silicon B Receiver Maximum Input Clock Frequency b Silicon A Silicon B
b
Maximum data rate at 4.1 MHz due to 2 x over clocking.
- -
16.4 24.6
MHz MHz
Maximum data rate at 2.05 MHz due to 8 x over clocking. Maximum data rate at 3.08 MHz due to 8 x over clocking. Maximum data rate at 2.05 MHz due to 8 x over clocking. Maximum data rate at 3.08 MHz due to 8 x over clocking.
- -
- -
16.4 24.6
MHz MHz
a. 50 ns minimum input pulse width is based on the input synchronizers running at 24 MHz (42 ns nominal period). b. Refer to the Ordering Information chapter on page 42.
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3. Electrical Specifications
3.4.5
AC Analog Output Buffer Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only. Table 3-23. 5V AC Analog Output Buffer Specifications
Symbol Description Min Typ Max Units
s s s s
Notes
TROB
Rising Settling Time to 0.1%, 1V Step, 100pF Load Power = Low Power = High - - - - 0.65 0.65 0.65 0.65 0.8 0.8 300 300 - - - - - - - - - - - - 2.5 2.5 2.2 2.2 - - - - - - - -
TSOB
Falling Settling Time to 0.1%, 1V Step, 100pF Load Power = Low Power = High
SRROB
Rising Slew Rate (20% to 80%), 1V Step, 100pF Load Power = Low Power = High V/s V/s V/s V/s MHz MHz kHz kHz
SRFOB
Falling Slew Rate (80% to 20%), 1V Step, 100pF Load Power = Low Power = High
BWOB
Small Signal Bandwidth, 20mVpp, 3dB BW, 100pF Load Power = Low Power = High
BWOB
Large Signal Bandwidth, 1Vpp, 3dB BW, 100pF Load Power = Low Power = High
Table 3-24. 3.3V AC Analog Output Buffer Specifications
Symbol Description Min Typ Max Units
s s s s
Notes
TROB
Rising Settling Time to 0.1%, 1V Step, 100pF Load Power = Low Power = High - - - - 0.5 0.5 0.5 0.5 0.7 0.7 200 200 - - - - - - - - - - - - 3.8 3.8 2.6 2.6 - - - - - - - -
TSOB
Falling Settling Time to 0.1%, 1V Step, 100pF Load Power = Low Power = High
SRROB
Rising Slew Rate (20% to 80%), 1V Step, 100pF Load Power = Low Power = High V/s V/s V/s V/s MHz MHz kHz kHz
SRFOB
Falling Slew Rate (80% to 20%), 1V Step, 100pF Load Power = Low Power = High
BWOB
Small Signal Bandwidth, 20mVpp, 3dB BW, 100pF Load Power = Low Power = High
BWOB
Large Signal Bandwidth, 1Vpp, 3dB BW, 100pF Load Power = Low Power = High
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3. Electrical Specifications
3.4.6
AC External Clock Specifications
The following tables list guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only. Table 3-25. 5V AC External Clock Specifications
Symbol Description Min Typ Max Units Notes
FOSCEXT - - -
Frequency High Period Low Period Power Up IMO to Switch
0.093 20.6 20.6 150
- - - -
24.6 5300 - -
MHz ns ns
s
Table 3-26. 3.3V AC External Clock Specifications
Symbol Description Min
a
Typ
Max
Units
Notes
FOSCEXT FOSCEXT - - -
Frequency with CPU Clock divide by 1
0.093 0.186 41.7 41.7 150
- - - - -
12.3 24.6 5300 - -
MHz MHz ns ns
s
Frequency with CPU Clock divide by 2 or greaterb High Period with CPU Clock divide by 1 Low Period with CPU Clock divide by 1 Power Up IMO to Switch
a. Maximum CPU frequency is 12 MHz at 3.3V. With the CPU clock divider set to 1, the external clock must adhere to the maximum frequency and duty cycle requirements. b. If the frequency of the external clock is greater than 12 MHz, the CPU clock divider must be set to 2 or greater. In this case, the CPU clock divider will ensure that the fifty percent duty cycle requirement is met.
3.4.7
AC Programming Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only. Table 3-27. AC Programming Specifications
Symbol Description Min Typ Max Units Notes
TRSCLK TFSCLK TSSCLK THSCLK FSCLK TERASEB TWRITE TDSCLK TDSCLK3
Rise Time of SCLK Fall Time of SCLK Data Set up Time to Falling Edge of SCLK Data Hold Time from Falling Edge of SCLK Frequency of SCLK Flash Erase Time (Block) Flash Block Write Time Data Out Delay from Falling Edge of SCLK Data Out Delay from Falling Edge of SCLK
1 1 40 40 0 - - - -
- - - - - 10 10 - -
20 20 - - 8 - - 45 50
ns ns ns ns MHz ms ms ns ns Vdd > 3.6 3.0 Vdd 3.6
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3. Electrical Specifications
3.4.8
AC I2C Specifications
The following table lists guaranteed maximum and minimum specifications for the voltage and temperature ranges: 4.75V to 5.25V and -40C TA 85C, or 3.0V to 3.6V and -40C TA 85C, respectively. Typical parameters apply to 5V and 3.3V at 25C and are for design guidance only. Table 3-28. AC Characteristics of the I2C SDA and SCL Pins
Standard Mode Symbol Description Min Max Fast Mode Min Max Units Notes
FSCLI2C THDSTAI2C TLOWI2C THIGHI2C TSUSTAI2C THDDATI2C TSUDATI2C TSUSTOI2C TBUFI2C TSPI2C
SCL Clock Frequency Hold Time (repeated) START Condition. After this period, the first clock pulse is generated. LOW Period of the SCL Clock HIGH Period of the SCL Clock Set-up Time for a Repeated START Condition Data Hold Time Data Set-up Time Set-up Time for STOP Condition Bus Free Time Between a STOP and START Condition Pulse Width of spikes are suppressed by the input filter.
0 4.0 4.7 4.0 4.7 0 250 4.0 4.7 -
100 - - - - - - - - -
0 0.6 1.3 0.6 0.6 0 100 0.6 1.3 0
a
400 - - - - - - - - 50
kHz
s s s s s
ns
s s
ns
a. A Fast-Mode I2C-bus device can be used in a Standard-Mode I2C-bus system, but the requirement tSU;DAT 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line trmax + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-Mode I2C-bus specification) before the SCL line is released.
SDA TLOWI2C TSUDATI2C THDSTAI2C
TSPI2C TBUFI2C
SCL S THDSTAI2C THDDATI2C THIGHI2C TSUSTAI2C TSUSTOI2C
Sr
P
S
Figure 3-9. Definition for Timing for Fast/Standard Mode on the I2C Bus
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4. Packaging Information
This chapter illustrates the packaging specifications for the CY8C27x43 PSoC device, along with the thermal impedances for each package and the typical package capacitance on crystal pins. Important Note Emulation tools may require a larger area on the target PCB than the chip's footprint. For a detailed description of the emulation tools' dimensions, refer to the document titled PSoC Emulator Pod Dimensions at http://www.cypress.com/support/link.cfm?mr=poddim.
4.1
Packaging Dimensions
51-85075 - *A
Figure 4-1. 8-Lead (300-Mil) PDIP
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4. Packaging Information
51-85077 - *C
Figure 4-2. 20-Lead (210-Mil) SSOP
51-85024 - *B
Figure 4-3. 20-Lead (300-Mil) Molded SOIC
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4. Packaging Information
51-85014 - *D
Figure 4-4. 28-Lead (300-Mil) Molded DIP
51-85079 - *C
Figure 4-5. 28-Lead (210-Mil) SSOP
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4. Packaging Information
51-85026 - *C
Figure 4-6. 28-Lead (300-Mil) Molded SOIC
51-85064-B
51-85064 - *B
Figure 4-7. 44-Lead TQFP
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4. Packaging Information
51-85061 -850 61-C 51 - *C
Figure 4-8. 48-Lead (300-Mil) SSOP
0.08 6.90 7.10 6.70 6.80 N 1.00 MAX.
C
0.05 MAX. 0.80 MAX. 0.20 REF.
X
0.230.05 N
PIN1 ID 0.20 R.
1 2 0.80 DIA. 6.90 7.10
1 2 0.45
6.70 6.80
E-PAD
Y
5.45 5.55
0.30-0.45 0-12 C SEATING PLANE 5.45 5.55 0.50 0.420.18 (4X)
TOP VIEW
SIDE VIEW
BOTTOM VIEW
DIMENSIONS IN mm MIN. MAX.
E-PAD SIZE PADDLE SIZE
(X, Y MAX.)
51-85152 - *B
Figure 4-9. 48-Lead (7x7 mm) MLF
51X51
53X53
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4. Packaging Information
4.2
Thermal Impedances
Package Typical JA *
Table 4-1. Thermal Impedances per Package
8 PDIP 20 SSOP 20 SOIC 28 PDIP 28 SSOP 28 SOIC 44 TQFP 48 SSOP 48 MLF * TJ = TA + POWER x JA
120 oC/W 95 oC/W 79 oC/W 67 oC/W 95 oC/W 71 oC/W 58 oC/W 69 oC/W 18 oC/W
4.3
Capacitance on Crystal Pins
Package Package Capacitance
Table 4-2: Typical Package Capacitance on Crystal Pins
8 PDIP 20 SSOP 20 SOIC 28 PDIP 28 SSOP 28 SOIC 44 TQFP 48 SSOP 48 MLF 2.8 pF 2.6 pF 2.5 pF 3.5 pF 2.8 pF 2.7 pF 2.6 pF 3.3 pF 2.3 pF
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5. Ordering Information
The following table lists the CY8C27x43 PSoC device family's key package features and ordering codes. Table 5-1. CY8C27x43 PSoC Device Family Key Features and Ordering Information
Analog Blocks Digital Blocks (Rows of 4)
(Columns of 3)
Switch Mode Pump
Temperature Range
Package
Ordering Code
CY8C27x43 Silicon B - These parts are lead free and offer the following improvements. The DEC_CR1 register selections are enhanced to allow any digital block to be the decimator clock source, the ECO EX and ECO EXW bits in the CPU_SCR1 register are readable, and the accuracy of the analog reference is enhanced (see the Electrical Specifications chapter). All silicon A errata are fixed in silicon B.
8 Pin (300 Mil) DIP 20 Pin (210 Mil) SSOP 20 Pin (210 Mil) SSOP (Tape and Reel) 20 Pin (300 Mil) SOIC 20 Pin 300 Mil) SOIC (Tape and Reel) 28 Pin (300 Mil) DIP 28 Pin (210 Mil) SSOP 28 Pin (210 Mil) SSOP (Tape and Reel) 28 Pin (300 Mil) SOIC 28 Pin (300 Mil) SOIC (Tape and Reel) 44 Pin TQFP 44 Pin TQFP (Tape and Reel) 48 Pin (300 Mil) SSOP 48 Pin (300 Mil) SSOP (Tape and Reel) 48 Pin (7x7) MLF 48 Pin (7x7) MLF (Tape and Reel)
CY8C27143-24PXI CY8C27243-24PVXI CY8C27243-24PVXIT CY8C27243-24SXI CY8C27243-24SXIT CY8C27443-24PXI CY8C27443-24PVXI CY8C27443-24PVXIT CY8C27443-24SXI CY8C27443-24SXIT CY8C27543-24AXI CY8C27543-24AXIT CY8C27643-24PVXI CY8C27643-24PVXIT CY8C27643-24LFXI CY8C27643-24LFXIT
16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16
256 256 256 256 256 256 256 256 256 256 256 256 256 256 256 256
No Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
-40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C
8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8
12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12
6 16 16 16 16 24 24 24 24 24 40 40 44 44 44 44
4 8 8 8 8 12 12 12 12 12 12 12 12 12 12 12
4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4
No Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes
CY8C27x43 Silicon A - Silicon A is not recommended for new designs.
8 Pin (300 Mil) DIP 20 Pin (210 Mil) SSOP 20 Pin (210 Mil) SSOP (Tape and Reel) 20 Pin (300 Mil) SOIC 20 Pin 300 Mil) SOIC (Tape and Reel) 28 Pin (300 Mil) DIP 28 Pin (210 Mil) SSOP
CY8C27143-24PI CY8C27243-24PVI CY8C27243-24PVIT CY8C27243-24SI CY8C27243-24SIT CY8C27443-24PI CY8C27443-24PVI
16 16 16 16 16 16 16
256 256 256 256 256 256 256
No Yes Yes Yes Yes Yes Yes
-40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C
8 8 8 8 8 8 8
12 12 12 12 12 12 12
6 16 16 16 16 24 24
4 8 8 8 8 12 12
4 4 4 4 4 4 4
No Yes Yes Yes Yes Yes Yes
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XRES Pin
Digital IO Pins
Flash (Kbytes)
Analog Outputs
RAM (Bytes)
Analog Inputs
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CY8C27x43 Final Data Sheet
5. Ordering Information
Table 5-1. CY8C27x43 PSoC Device Family Key Features and Ordering Information (continued)
Analog Blocks Digital Blocks (Rows of 4)
(Columns of 3)
Switch Mode Pump
Temperature Range
Package
Ordering Code
28 Pin (210 Mil) SSOP (Tape and Reel) 28 Pin (300 Mil) SOIC 28 Pin (300 Mil) SOIC (Tape and Reel) 44 Pin TQFP 44 Pin TQFP (Tape and Reel) 48 Pin (300 Mil) SSOP 48 Pin (300 Mil) SSOP (Tape and Reel) 48 Pin (7x7) MLF 48 Pin (7x7) MLF (Tape and Reel)
CY8C27443-24PVIT CY8C27443-24SI CY8C27443-24SIT CY8C27543-24AI CY8C27543-24AIT CY8C27643-24PVI CY8C27643-24PVIT CY8C27643-24LFI CY8C27643-24LFIT
16 16 16 16 16 16 16 16 16
256 256 256 256 256 256 256 256 256
Yes Yes Yes Yes Yes Yes Yes Yes Yes
-40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C
8 8 8 8 8 8 8 8 8
12 12 12 12 12 12 12 12 12
24 24 24 40 40 44 44 44 44
12 12 12 12 12 12 12 12 12
4 4 4 4 4 4 4 4 4
Yes Yes Yes Yes Yes Yes Yes Yes Yes
5.1
Ordering Code Definitions
Package Type: P = PDIP S = SOIC PV = SSOP LF = MLF A = TQFP Speed: 24 MHz Part Number Family Code Technology Code: C = CMOS Marketing Code: 8 = Cypress MicroSystems Company ID: CY = Cypress Thermal Rating: C = Commercial I = Industrial E = Extended
CY 8 C 27 xxx-SPxx
PX = PDIP Pb Free SX = SOIC Pb Free PVX = SSOP Pb Free LFX = MLF Pb Free AX = TQFP Pb Free
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XRES Pin
Digital IO Pins
Flash (Kbytes)
Analog Outputs
RAM (Bytes)
Analog Inputs
43
6. Sales and Service Information
To obtain information about Cypress MicroSystems or PSoC sales and technical support, reference the following information or go to the section titled "Getting Started" on page 4 in this document. Cypress MicroSystems
2700 162nd Street SW Building D Lynnwood, WA 98037 Phone: 800.669.0557 Facsimile: 425.787.4641 Web Sites: Company Information - http://www.cypress.com Sales - http://www.cypress.com/aboutus/sales_locations.cfm Technical Support - http://www.cypress.com/support/login.cfm
6.1
Revision History
CY8C27143, CY8C27243, CY8C27443, CY8C27543, and CY8C27643 PSoC Mixed Signal Array Final Data Sheet
Description of Change New document (Revision **). New electrical spec additions, fix of Core Architecture links, corrections to some text, tables, drawings, and format. Interrupt controller table fixed, refinements to Electrical Spec section and Register chapter. Significant changes to the Electrical Specifications section. Changes made to Electrical Spec section. Added 20/28-Lead SOIC packages and pinouts. Revised document for Silicon Revision A. Refinements to Electrical Specification section and I2C chapter. Revisions to GDI, RDI, and Digital Block chapters. Revisions to AC Digital Block Spec and miscellaneous register changes. New data sheet format and organization. Reference the PSoC Mixed Signal Array Technical Reference Manual for additional information. Title change. Added Silicon B information to this data sheet.
Table 6-1. CY8C27x43 Data Sheet Revision History
Document Title: Document Number: 38-12012 Revision ECN # Issue Date Origin of Change ** 127087 7/01/2003 New Silicon. *A 128780 7/29/2003 Engineering and NWJ. *B 128992 8/14/2003 NWJ *C 129283 8/28/2003 NWJ *D 129442 9/09/2003 NWJ *E 130129 10/13/2003 NWJ *F 130651 10/28/2003 NWJ *G 131298 11/18/2003 NWJ *H 229416 See ECN SFV SFV Posting: None
*I 247529 See ECN Distribution: External Public
6.2
Copyrights
Copyrights and Code Protection
(c) Cypress MicroSystems, Inc. 2000 - 2004. All rights reserved. PSoCTM, PSoC DesignerTM, and Programmable System-on-ChipTM are trademarks of Cypress MicroSystems, Inc. All other trademarks or registered trademarks referenced herein are property of the respective corporations. The information contained herein is subject to change without notice. Cypress MicroSystems assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress MicroSystems product. Nor does it convey or imply any license under patent or other rights. Cypress MicroSystems does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress MicroSystems products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress MicroSystems against all charges. Cypress MicroSystems products are not warranted nor intended to be used for medical, life-support, life-saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress MicroSystems.
Flash Code Protection
Note the following details of the Flash code protection features on Cypress MicroSystems devices. Cypress MicroSystems products meet the specifications contained in their particular Cypress MicroSystems Data Sheets. Cypress MicroSystems believes that its family of products is one of the most secure families of its kind on the market today, regardless of how they are used. There may be methods, unknown to Cypress MicroSystems, that can breach the code protection features. Any of these methods, to our knowledge, would be dishonest and possibly illegal. Neither Cypress MicroSystems nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Cypress MicroSystems is willing to work with the customer who is concerned about the integrity of their code. Code protection is constantly evolving. We at Cypress MicroSystems are committed to continuously improving the code protection features of our products.
August 3, 2004
(c) Cypress MicroSystems, Inc. 2002 - 2004 -- Document No. 38-12012 Rev. *I
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